A method for checking the problem of intersecting or repeated holes in the same layer of pcb board

Abstract

The invention discloses a method for checking the problem of intersecting or repeated holes in the same layer of the PCB board. The auxiliary tool obtains the via elements in all layers of the PCB file, and sets the side length of 100 mils with these via elements as the center. After measuring, compare the relationship between the distance between the via elements and the via elements in the square frame and the set value, so as to judge whether there is a problem of intersecting via holes on the same layer of the PCB board, and can Quickly locate the position of vias with intersection problems, and output the inspection result report, which greatly facilitates designers to quickly and accurately locate problematic vias, which is conducive to subsequent inspection and modification work, improves design work efficiency, and reduces the workload of designers. Ensure the quality of PCB board design and improve the yield of products.

Description

technical field [0001] The invention relates to the technical field of PCB design, and more specifically, relates to a method for checking the problem of intersecting or overlapping holes on the same layer of the PCB board. Background technique [0002] HDI is the abbreviation of High Density Interconnector. It is a technology for producing printed circuit boards (PCB boards). , designed as a circuit board with high line distribution density, HDI board has a full range of adaptable load capacity and strong short-term overload capacity, regardless of load power factor and peak factor, it is a compact design specially designed for small-capacity products product. [0003] In the design process of high-density HDI boards, due to the use of a large number of blind and buried vias, it is necessary to connect several blind and buried vias in the vertical direction when routing holes and changing layers. The distance of the network vias is relatively short, and intersecting error...

AI Technical Summary

Problems solved by technology

[0003] In the design process of high-density HDI boards, due to the use of a large number of blind and buried vias, it is necessary to connect several blind and buried vias in the vertical direction when routing holes and changing layers. The distance of the network vias is relatively short, and intersecting errors are prone to occur, and the intersecting vias cannot be correctly judged whether it is a blind buried via or a via short circuit through CAM or VALOR inspection. In this case, manual screening inspection is still required , increase the workload of the designer, the inspection efficiency is low, and the correct rate cannot be guaranteed, neither can the efficiency be improved nor the quality of the final product can be guaranteed. Therefore, it is necessary to pass the machine screening inspection during the design process to reduce the work intensity of the designer and improve the design of the product. correctness

[0004] ALLEGRO software is one of the mainstream software for designing PCB boards today. It has a good interactive working interface and powerful and perfect functions, and provides a good platform for high-speed, high-density, multi-layer complex PCB board design, but the software It does not have the ability to check the intersection of two via plates and problems, and cannot solve the above problems

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