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Conductive silver adhesive long in room-temperature use time and capable of being cured at low temperature and preparation method thereof

A conductive silver glue, a long-term technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems that affect the performance of conductive adhesives, the content of latent curing agents is large, and shorten the service life of conductive adhesives. Achieve the effect of prolonging the time of viscosity change, reducing viscosity and good conductivity

Inactive Publication Date: 2020-12-15
镝普材料(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing low-temperature curing conductive silver glue is placed at room temperature, and the viscosity of the conductive glue tends to increase, which affects the performance of the conductive glue and greatly shortens the service life of the conductive glue.
Moreover, the content of latent curing agent in the existing conductive adhesive is large, which directly and indirectly increases the viscosity of the conductive adhesive.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Equipped with the present invention, the conductive silver glue can be used for a long time at room temperature and can be cured at low temperature. It is prepared from the following components by weight:

[0021] The weight of each serving of the following ingredients is 1kg;

[0022] 70 parts of silver powder, 17.5 parts of epoxy resin, 1.8 parts of diisocyanate modified imidazole, 5.5 parts of reactive diluent, 0.26 part of coupling agent, 0.052 part of defoamer, and 0.09 part of dispersant.

[0023] Equipped with the present invention, which has a long service life at room temperature and can cure conductive silver glue at low temperature, it is realized by the following preparation method, including the following steps:

[0024] a. Put the predetermined amount of 17.5 parts of epoxy resin, 1.8 parts of diisocyanate modified imidazole, 5.5 parts of reactive diluent, 0.26 parts of coupling agent, 0.052 parts of defoamer, and 0.09 parts of dispersant in a room with a ...

Embodiment 2

[0027] Equipped with the present invention, the conductive silver glue can be used for a long time at room temperature and can be cured at low temperature. It is prepared from the following components by weight:

[0028] 72 parts of silver powder, 21.3 parts of epoxy resin, 2.2 parts of diisocyanate modified imidazole, 4 parts of reactive diluent, 0.22 part of coupling agent, 0.044 part of defoamer, and 0.13 part of dispersant.

[0029] Equipped with the present invention, which has a long service life at room temperature and can cure conductive silver glue at low temperature, it is realized by the following preparation method, including the following steps:

[0030] a. Predetermined 21.3 parts of epoxy resin, 2.2 parts of diisocyanate modified imidazole, 4 parts of reactive diluent, 0.22 part of coupling agent, 0.044 part of defoamer, 0.13 part of dispersant in room temperature and humidity of 60% Stir under ambient conditions for 20 minutes to become a uniform liquid, and pr...

Embodiment 3

[0032] Equipped with the present invention, the conductive silver glue can be used for a long time at room temperature and can be cured at low temperature. It is prepared from the following components by weight:

[0033] The weight of each serving of the following ingredients is 1kg;

[0034] 75 parts of silver powder, 20 parts of epoxy resin, 1.5 parts of diisocyanate modified imidazole, 4.8 parts of reactive diluent, 0.18 part of coupling agent, 0.036 part of defoamer, and 0.11 part of dispersant.

[0035] Equipped with the present invention, which has a long service life at room temperature and can cure conductive silver glue at low temperature, it is realized by the following preparation method, including the following steps:

[0036] a. Put a predetermined amount of 75 parts of silver powder, 20 parts of epoxy resin, 1.5 parts of diisocyanate modified imidazole, 4.8 parts of reactive diluent, 0.18 part of coupling agent, 0.036 part of defoamer, and 0.11 part of dispersant...

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Abstract

The invention relates to the technical field of adhesives for the 3C electronic industry, in particular to a conductive silver adhesive capable of being used for a long time at room temperature and cured at a low temperature and a preparation method of the conductive silver adhesive. The conductive silver adhesive comprises 70-75 parts of silver powder, 17.5-21.3 parts of epoxy resin, 1.5-2.2 parts of diisocyanate modified imidazole, 4-5.5 parts of a reactive diluent, 0.18-0.26 part of a coupling agent, 0.036-0.052 part of a defoamer and 0.09-0.13 part of a dispersant. According to the conductive silver adhesive prepared by the formula and the preparation method thereof, the storage period of the conductive silver adhesive can be prolonged, and the viscosity of the conductive silver adhesive is not increased.

Description

technical field [0001] The invention relates to the technical field of adhesives for 3C electronics industry, in particular to a conductive silver adhesive that can be cured at low temperature and has a long service life at room temperature and a preparation method thereof. Background technique [0002] At present, the demand for conductive adhesives in the 3C industry tends to be cured at low temperatures, which is more conducive to protecting the performance of other components. The existing low-temperature curing conductive silver glue is placed at room temperature, and the viscosity of the conductive glue tends to increase, which affects the performance of the conductive glue and greatly shortens the service life of the conductive glue. Moreover, the content of latent curing agent in the existing conductive adhesive is large, which directly and indirectly increases the viscosity of the conductive adhesive. Contents of the invention [0003] The object of the present i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C08G59/50
CPCC08G59/5073C08K2003/0806C08K2201/005C08K2201/014C09J9/02C09J163/00C08K7/00C08K3/08C08K7/18
Inventor 陈维林马灵
Owner 镝普材料(深圳)有限公司
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