Semiconductor package

Abstract

Provided is a semiconductor package modularized and manufactured by preparing a main block for putting on a semiconductor chip, an insulator, and one or more sub block, preparing the semiconductor chip, preparing an adhesive used in attaching the semiconductor chip, attaching the semiconductor chip to an upper surface or upper and lower surfaces of the main block, performing an electrical connection of the semiconductor chip, preparing a substrate comprising a pattern enabling an electrical connection and vertically attaching one side of the main block to the pattern of the substrate to enablean electrical connection. In the semiconductor package above, an accumulation rate increases on the substrate 140 due to a vertically arranged structure of the semiconductor chips 111 and a heat emission area is enlarged to improve a heat emission effect.

Description

technical field [0001] The present invention relates to a semiconductor package, and in more detail, relates to a semiconductor package that increases the concentration rate on a substrate through a vertical arrangement structure of semiconductor chips, and expands the heat dissipation area to improve the heat dissipation effect. [0002] Also, the present invention relates to a semiconductor package that improves the aggregation rate of semiconductor chips by means of a vertical attachment structure of semiconductor chips of a main module on a substrate. Background technique [0003] Generally speaking, as shown in a of FIG. 1 , the semiconductor package is to install the semiconductor chip 20 on the substrate 10 inside the semiconductor package body 60, and connect the semiconductor chip 20 and the substrate 10 to each other through the metal clip 31 or the conductive wiring 32. And formed. [0004] Alternatively, as shown in b of FIG. 1 , the semiconductor package is a l...

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Problems solved by technology

[0005] Moreover, the semiconductor chip 20 is installed in the horizontal direction on the substrate 10, 10A, 10B, thus, the horizontal structure of the metal clip 31 or the conductive wiring 32 makes the heat dissipation not smooth, therefore, in order to reduce the heat generation of the semiconductor chip 20, it is necessary to add another The heat sink (heat slug) heat dissipation

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