Refrigeration type LTCC micro-system based on metal micro-channels and preparation method of refrigeration type LTCC micro-system

Abstract

The invention discloses a refrigeration type LTCC micro-system based on metal micro-channels and a preparation method thereof. The refrigeration type LTCC micro-system comprises an LTCC substrate, a metal block with a plurality of micro-channels, a heat source chip, a plurality of TEC chips, a plurality of devices, an enclosure frame, a cover plate and a plurality of pins. The cold end cooling capacity of the TEC chips is used for cooling the heat source chip, and meanwhile it is guaranteed that the temperature in the closed space on the upper layer can reach a low-temperature state. The heatgenerated by the hot ends of the TEC chips is transferred to the cooling liquid in the micro-channels in the metal block through the large-area metal block below the TEC chips, and the cooling liquidbrings the heat to the outside of the LTCC substrate through the micro-channels 7 to achieve the purpose of heat dissipation.

Description

technical field [0001] The invention belongs to the technical field of microelectronic integrated heat dissipation and refrigeration, and in particular relates to a cooling type LTCC microsystem based on a metal microflow channel and a preparation method thereof. Background technique [0002] The rapid development of microelectronics technology and the miniaturization of electronic products have made LTCC (Low Temperature Co-fired Ceramic) substrates with high-density integration features more and more attention, whether it is radio communication, military or civilian LTCC technology has been involved in the fields such as LTCC technology, and the combination method of relying on LTCC technology and adding a cover plate and a frame on it can ensure the miniaturization of the entire system, but the thermal conductivity of LTCC is generally 2-3W / mk, which is difficult To meet the heat dissipation requirements of high-power chips in microsystems, in order to solve the problem o...

AI Technical Summary

Problems solved by technology

[0004] The introduction of microchannels has brought many problems, and the existing shortcomings are: (1) When preparing microchannels, it is necessary to fill them with sacrificial materials, and the shape of the sacrificial materials needs to be precisely matched with the shape of the microchannels. It brings difficulty to the process, precise processing is very difficult and it is difficult to fill it into the micro-channel accurately; (2) At present, graphite and carbon ribbons are mostly used as sacrificial materials, and carbon will be left if they cannot be completely burned during the co-firing process. Impurities have a great impact on the characteristics of the circuit; (3) if the sacrificial material is improperly prepared, it cannot match the ceramic characteristics of the LTCC material, which may cause serious problems such as the collapse and deformation of the substrate; (4) currently affected by the process Fabricated microchannels are limited in size

However, it still uses sintering to volatilize the sacrificial material to ensure the formation of microchannels and has no cooling effect. If the cross-sectional area of ​​microchannels continues to expand, it may cause problems such as collapse.

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