Refrigeration type LTCC micro-system based on metal micro-channels and preparation method of refrigeration type LTCC micro-system

A micro-system, refrigeration-type technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of difficulty, precision processing, and filling, and achieve high-efficiency cooling and heat dissipation, and the cooling accuracy is controllable , the effect of fast cooling

Active Publication Date: 2020-12-18
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The introduction of microchannels has brought many problems, and the existing shortcomings are: (1) When preparing microchannels, it is necessary to fill them with sacrificial materials, and the shape of the sacrificial materials needs to be precisely matched with the shape of the microchannels. It brings difficulty to the process, precise processing is very difficult and it is difficult to fill it into the micro-channel accurately; (2) At present, graphite and carbon ribbons are mostly used as sacrificial materials, and carbon will be left if they cannot be completely burned during the co-firing proc

Method used

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  • Refrigeration type LTCC micro-system based on metal micro-channels and preparation method of refrigeration type LTCC micro-system
  • Refrigeration type LTCC micro-system based on metal micro-channels and preparation method of refrigeration type LTCC micro-system
  • Refrigeration type LTCC micro-system based on metal micro-channels and preparation method of refrigeration type LTCC micro-system

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Embodiment 1

[0060] See figure 1 , figure 2 with image 3 , figure 1 It is a schematic structural diagram of a cooling LTCC microsystem based on metal microchannels provided by an embodiment of the present invention, figure 2 It is a front view of a metal microchannel-based cooling LTCC microsystem provided by an embodiment of the present invention, image 3 It is a left view of a cooling LTCC microsystem based on a metal microchannel provided by an embodiment of the present invention. This embodiment provides a refrigerated LTCC microsystem based on metal microchannels, the refrigerated LTCC microsystem includes: an LTCC substrate 5, a metal block 6 with several microchannels 7, a heat source chip 4, and several TEC chips 3 , a number of devices 9, a surrounding frame 2, a cover plate 1, and a number of pins 10, wherein the LTCC substrate 5 is provided with a groove 8 penetrating the LTCC substrate along a first direction, wherein the first direction is, for example, the length dire...

Embodiment 2

[0063] See Figure 4 , Figure 4 It is a flow chart of a process for preparing a microsystem packaging with TEC and microfluidics provided by the embodiment of the present invention. On the basis of the foregoing embodiments, the present invention also provides a method for preparing a refrigeration type LTCC microsystem based on metal microchannels, the preparation method comprising:

[0064] Step 1, see Figure 5 , the LTCC substrate 5 is prepared, and the LTCC substrate 5 is provided with a groove 8 penetrating the LTCC substrate 5 along the first direction.

[0065] Step 1.1. Select several lower-layer green porcelain sheets and several upper-layer green porcelain sheets.

[0066] Specifically, for example, DuPont951 is selected as the material of the green ceramic sheet, and all the green ceramic sheets are classified, and the green ceramic sheet is divided into a lower layer of green ceramic sheet and an upper layer of green ceramic sheet, wherein the thickness of a s...

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Abstract

The invention discloses a refrigeration type LTCC micro-system based on metal micro-channels and a preparation method thereof. The refrigeration type LTCC micro-system comprises an LTCC substrate, a metal block with a plurality of micro-channels, a heat source chip, a plurality of TEC chips, a plurality of devices, an enclosure frame, a cover plate and a plurality of pins. The cold end cooling capacity of the TEC chips is used for cooling the heat source chip, and meanwhile it is guaranteed that the temperature in the closed space on the upper layer can reach a low-temperature state. The heatgenerated by the hot ends of the TEC chips is transferred to the cooling liquid in the micro-channels in the metal block through the large-area metal block below the TEC chips, and the cooling liquidbrings the heat to the outside of the LTCC substrate through the micro-channels 7 to achieve the purpose of heat dissipation.

Description

technical field [0001] The invention belongs to the technical field of microelectronic integrated heat dissipation and refrigeration, and in particular relates to a cooling type LTCC microsystem based on a metal microflow channel and a preparation method thereof. Background technique [0002] The rapid development of microelectronics technology and the miniaturization of electronic products have made LTCC (Low Temperature Co-fired Ceramic) substrates with high-density integration features more and more attention, whether it is radio communication, military or civilian LTCC technology has been involved in the fields such as LTCC technology, and the combination method of relying on LTCC technology and adding a cover plate and a frame on it can ensure the miniaturization of the entire system, but the thermal conductivity of LTCC is generally 2-3W / mk, which is difficult To meet the heat dissipation requirements of high-power chips in microsystems, in order to solve the problem o...

Claims

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Application Information

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IPC IPC(8): H01L23/14H01L23/04H01L23/498H01L23/473H01L21/48
CPCH01L23/14H01L23/04H01L23/49822H01L23/49838H01L23/473H01L21/4857H01L21/4871
Inventor 王斌蔺孝堃史鑫龙陈睿王坤宋宇祥胡辉勇
Owner XIDIAN UNIV
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