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Tin soldering oil smearing treatment method for COF flexible printed circuit board

A technology of flexible printing and processing method, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc. It can solve the problem that the soldering effect is not so impressive, and achieve good results

Active Publication Date: 2020-12-18
衡阳华灏新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Soldering is often required during the processing of COF flexible printed circuit boards, but it is necessary to apply solder oil as a flux when soldering, but the current application is often simply applied without other treatment, resulting The final soldering effect is not so impressive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for smearing solder oil on a COF flexible printed circuit board, comprising the following steps:

[0025] S1. First, perform preliminary cleaning on the COF flexible printed circuit board;

[0026] S2. Wipe the cleaned COF flexible printed circuit board with alcohol cotton ball;

[0027] S3. Choose a suitable amount of solder oil and put the solder oil in a container. The solder oil consists of 35 parts of adhesive film-forming agent, 2 parts of dibromoethylbenzene, 4 parts of triethanolamine, 2 parts of methanol, and 25 parts of tin. , 4 parts of succinic acid;

[0028] S4. Heat the solder oil placed inside the container, the heating time is 10min, and the heating temperature is 60°C;

[0029] S5, add activator again when heating, then continue heating, activator is ammonium chloride solution and ethylenediamine phosphate solution mixture, the ratio between ammonium chloride solution and ethylenediamine phosphate solution is 3:7;

[0030] S6. Stir while hea...

Embodiment 2

[0035] A method for smearing solder oil on a COF flexible printed circuit board, comprising the following steps:

[0036] S1. First, perform preliminary cleaning on the COF flexible printed circuit board;

[0037] S2. Wipe the cleaned COF flexible printed circuit board with alcohol cotton ball;

[0038] S3. Choose a suitable amount of solder oil, and put the solder oil in a container. The solder oil contains 36 parts of adhesive film-forming agent, 2.5 parts of dibromoethylbenzene, 4.5 parts of triethanolamine, 2.5 parts of methanol, and 30 parts of tin. , 4.5 parts of succinic acid;

[0039] S4. Heat the solder oil placed inside the container, the heating time is 11 minutes, and the heating temperature is 62°C;

[0040] S5, add activator again when heating, then continue heating, activator is ammonium chloride solution and ethylenediamine phosphate solution mixture, the ratio between ammonium chloride solution and ethylenediamine phosphate solution is 3:7;

[0041] S6. Sti...

Embodiment 4

[0057] A method for smearing solder oil on a COF flexible printed circuit board, comprising the following steps:

[0058] S1. First, perform preliminary cleaning on the COF flexible printed circuit board;

[0059] S2. Wipe the cleaned COF flexible printed circuit board with alcohol cotton ball;

[0060] S3. Choose a suitable amount of solder oil, and put the solder oil in a container. The solder oil contains 37 parts of adhesive film former, 3 parts of dibromoethylbenzene, 6 parts of triethanolamine, 3.5 parts of methanol, and 37 parts of tin. , 6 parts of succinic acid;

[0061] S4. Heat the solder oil placed inside the container, the heating time is 13min, and the heating temperature is 65°C;

[0062] S5, add activator again when heating, then continue heating, activator is ammonium chloride solution and ethylenediamine phosphate solution mixture, the ratio between ammonium chloride solution and ethylenediamine phosphate solution is 3:7;

[0063] S6. Stir while heating, s...

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PUM

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Abstract

The invention relates to the technical field of COF flexible printed circuit boards, and discloses a tin soldering oil smearing processing method for a COF flexible printed circuit board, and the method comprises the following steps: S1, carrying out the preliminary cleaning of the COF flexible printed circuit board; s2, wiping the cleaned COF flexible printed circuit board by using an alcohol cotton ball; s3, selecting a proper amount of soldering tin oil, and putting the soldering tin oil into a container; s4, heating the soldering tin oil placed in the container; s5, adding an activating agent during heating, and continuously heating; and S6, stirring during heating for fully mixing the activating agent and the soldering tin oil together. By improving an existing smearing method, the tin soldering oil is treated, a silk-screen printing film and a steel needle are used in the smearing process, it is guaranteed that the situation of insufficient soldering caused by bubbles cannot occur in the later-period welding process, and the purpose of a good later-period tin soldering effect is achieved.

Description

technical field [0001] The invention relates to the technical field of COF flexible printed circuit boards, in particular to a method for smearing solder oil on COF flexible printed circuit boards. Background technique [0002] COF (ChipOnFilm, chip-on-film) refers to the soft additional circuit board of unpackaged chips, and COF chips refer to source driver ICs, gate driver ICs, etc. In the assembly of LCD TVs, COF is used as the chip carrier, and the chip is bonded to the flexible substrate circuit. [0003] Soldering is often required during the processing of COF flexible printed circuit boards, but it is necessary to apply solder oil as a flux when soldering, but the current application is often simply applied without other treatment, resulting In the end, the soldering effect was not so impressive. Contents of the invention [0004] The object of the present invention is to provide a method for smearing solder oil on a COF flexible printed circuit board. [0005] I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/3457H05K3/3489
Inventor 刘河洲余光明吴飞龙刘国重
Owner 衡阳华灏新材料科技有限公司
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