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Pre-embedded oxygen-free packaging detection method of integrated circuit board

A technology for integrated circuit boards and detection methods, which is applied in the direction of circuit, electrical components, semiconductor/solid-state device testing/measurement, etc. It can solve problems such as high process requirements, difficult anaerobic packaging, and circuit oxidation, so as to reduce residue and improve packaging. The effect of improving quality and improving accuracy

Inactive Publication Date: 2020-12-22
王明雁
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing integrated circuits tend to have air remaining in the plastic packaging compound on the package, and the oxygen in the air has the risk of oxidizing the circuit during the operation of the integrated circuit. The conventional vacuum pumping method is not only cumbersome but also requires high technology. And in the process of injecting the plastic encapsulant, there will still be a small amount of air trapped in it, making it difficult to truly realize oxygen-free encapsulation

Method used

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  • Pre-embedded oxygen-free packaging detection method of integrated circuit board
  • Pre-embedded oxygen-free packaging detection method of integrated circuit board
  • Pre-embedded oxygen-free packaging detection method of integrated circuit board

Examples

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Embodiment 1

[0046] see figure 1 , a kind of pre-embedded oxygen-free encapsulation detection method of integrated circuit board, comprises the following steps:

[0047] S1. Mount the integrated circuit board to be packaged on the carrier substrate 2, and then install the embedded detection rod on the integrated circuit board;

[0048] S2, lead the electrodes on the integrated circuit board through the pre-embedded detection rods, then close the packaging mold 1 made in advance, and check whether there is any gap;

[0049] S3. After preheating the pre-prepared plastic sealing compound, slowly inject the plastic sealing compound from the injection port on the packaging mold 1 until it is flush;

[0050] S4. After heating and solidifying the plastic encapsulant to form an encapsulation body, wait for the encapsulation body to cool down and then remove the encapsulation mold 1;

[0051] S5. Trigger the detection of the pre-embedded detection rod, and observe whether there is a significant t...

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Abstract

The invention discloses a pre-embedded oxygen-free packaging detection method for an integrated circuit board, belongs to the technical field of circuit packaging, and can realize innovative embeddingof a pre-embedded detection rod in the packaging process of the integrated circuit board; therefore, on the one hand, leads can be conveniently led out of a packaging body from the integrated circuitboard; on the other hand, oxygen detection can be carried out in the encapsulation body in a water supply triggering mode after encapsulation is finished, oxygen is consumed while the oxygen is detected in a first communication and air suction mode, then stable carbon dioxide gas is released, residual oxygen can be expelled, residual oxygen is reduced, and the residual oxygen is pre-stored in theencapsulation body, so even if air leakage occurs in the later period, external air can be prevented from entering by utilizing the filling property of carbon dioxide, so certain time is provided foroverhauling of technicians, and the packaging quality of the integrated circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of circuit packaging, and more specifically, to a detection method for pre-embedded anaerobic packaging of integrated circuit boards. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit. The inventors of the integrated circuit are Jack Kilby (germanium (Ge)-based integrated circuits) and Robert Noyce (silicon (S...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L21/56
CPCH01L21/565H01L22/30
Inventor 王明雁
Owner 王明雁
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