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Electronic control module of electronic detonator and production process method of electronic control module

A technology of electronic control module and electronic detonator, which is applied in the direction of weapon accessories, fuzes, offensive equipment, etc., can solve the problems of short process chain, complex manufacturing process, large size of post-welding electrolytic capacitors, etc., and achieve the effect of improving production efficiency

Inactive Publication Date: 2020-12-25
重庆云铭科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of the first mode is that the size of the tantalum capacitor is small, and the manufacturing process of the whole module is simple, there are few types of work, and the process chain is short; the disadvantage is that the price of the chip tantalum capacitor is high, and the performance of the low-temperature environment is greatly attenuated, or even fails.
The advantage of the second type of mold is that the cost of post-welding electrolytic capacitors is low, and it can meet the performance requirements of low-temperature environments. It is necessary to cooperate with the design of special pin connectors (commonly known as capacitor brackets or capacitor brackets), and this connector can only use the post-welding process, resulting in complex manufacturing processes for the overall module, multiple types of work, and long process chains

Method used

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  • Electronic control module of electronic detonator and production process method of electronic control module
  • Electronic control module of electronic detonator and production process method of electronic control module
  • Electronic control module of electronic detonator and production process method of electronic control module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] like Figure 1-4 As shown, this embodiment first provides an electronic detonator electronic control module, including module encapsulation injection molding blocks 1-22, a control circuit main board 3 and a patch bridge wire terminal 4, which is characterized in that: it also includes a sticker with a connector. The chip electrolytic capacitor 1, the chip electrolytic capacitor 1 with a connector, the module encapsulation injection molding block 1-22, the control circuit main board 3 and the patch bridge wire terminal 4 are integrally connected.

[0047] The patch type electrolytic capacitor 1 with a connector includes a pin connector 1-1, an encapsulation injection molding block 1-2 and an electrolytic capacitor 1-3 which are connected in sequence.

[0048] The length of the patch end of the pin connector 1-1 in the axial direction is smaller than the length of the pins of the electrolytic capacitor 1-3.

[0049] The upper surface of the patch end of the foot wire co...

Embodiment 2

[0066] like Figure 1-4 As shown, this embodiment firstly provides an electronic control module for an electronic detonator, including a module encapsulation injection molding block 1-22, a control circuit main board 3 and a chip bridge wire terminal 4, and is characterized in that: it also includes a chip with a connector The chip electrolytic capacitor 1, the chip electrolytic capacitor 1 with a connector, the module encapsulation injection molding block 1-22, the control circuit main board 3 and the chip bridge wire terminal 4 are integrally connected.

[0067] Further, the SMD electrolytic capacitor with connector 1 includes a leg connector 1-1, an encapsulating injection molding block 1-2 and an electrolytic capacitor 1-3 connected in sequence.

[0068] Further, the length of the patch end of the leg connector 1-1 in the axial direction is smaller than the length of the pins of the electrolytic capacitor 1-3.

[0069] Further, the upper surface of the patch end of the le...

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Abstract

The invention discloses an electronic control module of an electronic detonator. The electronic control module comprises a module encapsulation and injection molding block, a control circuit mainboard, a chip bridge wire terminal and a chip electrolytic capacitor with a connector, wherein the chip electrolytic capacitor with the connector, the module encapsulation and injection molding block, thecontrol circuit mainboard and the chip bridge wire terminal are integrally connected. The invention further discloses a production process method for producing the electronic control module. The manufacturing process is completed through encapsulation, injection molding and makeup. According to the production process method, a backhand-welding capacitor and a backhand-welding leg wire connector are integrally designed into an integrated chip piece, so that a backhand-welding process is avoided, and the whole process is fundamentally optimized; and a specially-designed makeup mode is adopted ineach procedure, the lifting stress effect of a simple support beam can be achieved in the whole process of chip mounting and backhand-welding of the chip electrolytic capacitor with the connector byadopting the makeup mode, therefore, automatic chip mounting is completely realized through a chip mounter, and production efficiency is greatly improved.

Description

technical field [0001] The invention relates to the field of electronic detonators, in particular to an electronic control module of an electronic detonator and a production process method thereof. Background technique [0002] The control core unit of the electronic detonator is the electronic control module (hereinafter referred to as the module). The module is mainly composed of ignition components, control circuits, energy storage capacitors, external connection ports / connectors and injection molding packaging blocks. Since the entire module needs to be assembled and inserted into the detonator shell, the overall volume of the module is required to be small and compact. And because the electronic detonator is a one-time consumable, the overall shape design of the module is required to be convenient for mass manufacture and assembly. [0003] At present, there are usually two overall structure modes of modules in the industry, one is "SMD ignition device + control circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F42C19/12F42C17/04
CPCF42C19/12F42C17/04
Inventor 郑凯李明政
Owner 重庆云铭科技股份有限公司
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