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Preparation method of matrix ray imaging plate

An imaging board and matrix technology, which is applied in the fields of radiography, medical and industrial fields in security inspection, can solve the problems of high cost, large device size and limited imaging area.

Active Publication Date: 2021-01-01
SHANGHAI DONGZHOU IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantages of the existing technology are that the formation of the array of the above-mentioned inorganic semiconductor devices has a complex process structure, cannot be bent, the imaging area is limited, the pixels are large, the cost is expensive, and the device volume is large, etc.

Method used

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  • Preparation method of matrix ray imaging plate
  • Preparation method of matrix ray imaging plate

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Embodiment Construction

[0012]The present invention is a method for preparing a matrix type radiographic imaging plate; it includes a nano-ray detection material, a reflective layer, an absorber, a resin binder, and a protective layer; it is characterized in that the binder, the absorber, and the radiation detection material are carried out in proportion Mix and granulate, then put the granulated mixture in the mold, add a reflective film at the bottom of the mold, use hot pressing to prepare the material into a plate, and then use screen printing, spraying, and scraping on the surface The protective layer is prepared and the matrix columns are prepared on the surface of the imaging plate at the same time to obtain the required radiographic imaging plate. The use of the matrix imaging plate and the TFT imaging device can realize radiographic imaging.

[0013]The nano-ray detection material in the present invention is ZnS; Ag, BaFCl; Eu, BaCl2, GOS; Tb, GOS; Pr, one or more of; its particle size distribution r...

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Abstract

The invention discloses a preparation method of a matrix type ray imaging plate. The reflective film comprises a nano-ray detection material, a reflective layer, an absorbent, a resin binder and a protective layer, the method is characterized by comprising the following steps: mixing and granulating an adhesive, an absorbent and a ray detection material in proportion, putting the granulated mixture into a mold, adding a reflective film to the bottom of the mold, carrying out hot pressing on the material in a hot pressing mode to prepare a plate, and preparing a protective layer on the surfacein a silk-screen printing, spraying and blade coating mode, preparing a matrix array on the surface of the imaging plate to obtain the required ray imaging plate, and performing ray imaging by cooperatively using the matrix imaging plate and a TFT imaging device.

Description

Technical field[0001]The invention belongs to the technical field of radiography in medical, industrial and security inspection.Background technique[0002]Existing X-ray imaging has been widely used in real-time imaging of medical diagnosis, large-scale security imaging, etc. The structure of existing imaging sensor technology products is mainly composed of: ray fluorescent plate, inorganic semiconductor light sensor element, control supporting circuit, etc. Semiconductor light-sensing elements are mainly amorphous silicon, amorphous selenium, CMOS, CCD, etc. These solid-state semiconductor devices form a complex matrix of photosensitive pixel plates, which convert fluorescent images into electrical signals, thereby forming digital image generation and storage. The disadvantages of the prior art are that the above-mentioned inorganic semiconductor device forming an array has a complicated process structure, is not flexible, has limited imaging area, large pixels, high cost, and large...

Claims

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Application Information

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IPC IPC(8): H01L27/146H01L27/12
CPCH01L27/14676H01L27/1214
Inventor 郭素文郑岩张瑞君全丽华蔡震涛陈磊
Owner SHANGHAI DONGZHOU IND