Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A three-dimensional dual-mode electrical impedance imaging sensor and its manufacturing method

A technology of electrical impedance imaging and resistance sensor, which is applied in the direction of instruments, scientific instruments, material resistance, etc., can solve the problems of low excitation frequency and poor system resolution of EIT technology, and achieve improved quality and speed, easy portability, and low cost Effect

Active Publication Date: 2021-11-16
BEIHANG UNIV
View PDF11 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above problems have caused the poor system resolution of EIT technology
[0005] Traditional EIT sensors mostly use the point electrode mode, which equates the measured object field into a resistance model, mainly to obtain the conductivity distribution information, and needs to contact the electrode with the skin so that the excitation current can be injected into the measured area, and the excitation frequency is usually low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A three-dimensional dual-mode electrical impedance imaging sensor and its manufacturing method
  • A three-dimensional dual-mode electrical impedance imaging sensor and its manufacturing method
  • A three-dimensional dual-mode electrical impedance imaging sensor and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] refer to Figure 2-3 , the present invention provides a three-dimensional dual-mode electrical impedance imaging sensor, including a hemispherical sensor support, a capacitive sensor and a resistive sensor....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a three-dimensional dual-mode electrical impedance imaging sensor and a manufacturing method thereof. The sensor includes a hemispherical sensor support, a capacitance sensor and a resistance sensor, the capacitance sensor is arranged on the hemispherical support, and the resistance sensor and the Capacitive sensor snap-in. The sensor provided by the invention is combined with the electrical impedance measurement system to obtain the three-dimensional surface capacitance and resistance information of the hemispherical measurement area, which is used for the reconstruction of the permittivity and conductivity distribution of the three-dimensional hemispheric area. Utilizing the difference in electrical properties between breast tissue and cancer tissue, the sensor provided by the invention can be applied to early screening of female breast cancer, and has the advantages of low cost, easy portability, and no harm to the human body.

Description

technical field [0001] The invention relates to the field of three-dimensional electrical impedance imaging, in particular to a three-dimensional dual-mode electrical impedance imaging sensor and a manufacturing method. Background technique [0002] Electrical Impedance Tomography (EIT), developed on the basis of electrical impedance measurement technology, is a technology aimed at reconstructing the distribution of electrical properties inside the human body. EIT technology has unique advantages such as no radiation, no special environment, low cost, high cost performance, non-invasive, fast speed, etc. It is gradually developing into an important supplementary means for early screening and diagnosis of breast cancer, and is expected to become a daily tool for community-level hospitals and even individuals. Portable medical instruments used in nursing care are of great significance for reducing the occurrence of breast diseases and improving the survival rate of patients, a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/04G01N27/22
CPCG01N27/041G01N27/221
Inventor 孙世杰王景浩王颖卢旭鹏徐立军
Owner BEIHANG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com