An ultra-small sealed high-temperature and high-pressure connector
A high-temperature, high-pressure, sealed technology, which is applied in the direction of connection, parts of connection devices, contact parts, etc., can solve problems such as high price, abnormal use of connectors, deformation of adhesive or sintered materials, etc., and achieve large specific surface area Effect
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Embodiment 1
[0048] An ultra-small sealed high-temperature and high-pressure connector, including an outer shell 1, an inner conductor 2 and an insulating material 3, the insulating material 3 is arranged between the outer shell 1 and the inner conductor 2; the inner conductor 2 is located on the insulating material The pressure end of 3 is provided with pressure platform 4.
[0049] A special adhesive is coated between the outer casing 1 and the inner conductor 2 and between the inner conductor 2 and the insulating material 3 .
[0050] The special adhesive consists of the following components in parts by weight:
[0051] 100 parts of bismaleimide modified resin, 30 parts of novolak resin, 8 parts of metal oxide powder, 7 parts of polyvinyl alcohol, 2 parts of dispersant and 50 parts of organic solvent.
[0052] The insulating material 3 is prepared from a modified polybutylene adipamide material, and the modified polybutylene adipamide material is modified by organic zirconium / haloysite...
Embodiment 2
[0081] An ultra-small sealed high-temperature and high-pressure connector, including an outer shell 1, an inner conductor 2 and an insulating material 3, the insulating material 3 is arranged between the outer shell 1 and the inner conductor 2; the inner conductor 2 is located on the insulating material The pressure end of 3 is provided with pressure platform 4.
[0082] A special adhesive is coated between the outer casing 1 and the inner conductor 2 and between the inner conductor 2 and the insulating material 3 .
[0083] The special adhesive consists of the following components in parts by weight:
[0084] 100 parts of bismaleimide modified resin, 20 parts of novolak resin, 5 parts of metal oxide powder, 3 parts of polyvinyl alcohol, 0.1 part of dispersant and 30 parts of organic solvent.
[0085] The insulating material 3 is prepared from a modified polybutylene adipamide material, and the modified polybutylene adipamide material is modified by organic zirconium / haloysit...
Embodiment 3
[0114] An ultra-small sealed high-temperature and high-pressure connector, including an outer shell 1, an inner conductor 2 and an insulating material 3, the insulating material 3 is arranged between the outer shell 1 and the inner conductor 2; the inner conductor 2 is located on the insulating material The pressure end of 3 is provided with pressure platform 4.
[0115] A special adhesive is coated between the outer casing 1 and the inner conductor 2 and between the inner conductor 2 and the insulating material 3 .
[0116] The special adhesive consists of the following components in parts by weight:
[0117] 100 parts of bismaleimide modified resin, 40 parts of novolak resin, 10 parts of metal oxide powder, 10 parts of polyvinyl alcohol, 5 parts of dispersant and 80 parts of organic solvent.
[0118] The insulating material 3 is prepared from a modified polybutylene adipamide material, and the modified polybutylene adipamide material is modified by organic zirconium / haloysi...
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Abstract
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