Multilayer board for V_CUT depth detection by electrical testing

A deep detection, multi-layer board technology, applied in the direction of circuit inspection/identification, electrical components, printed circuits, etc., can solve the problems of increasing the workload of workers, reducing the production efficiency of circuit boards, and unable to divide the boards, so as to avoid production rework or Scrap, realize V_CUT test, reduce the troublesome effect of manual inspection

Active Publication Date: 2021-01-05
深圳市强达电路股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, on the one hand, the probability of missed detection and false detection is high, and on the other hand, the rework rate due to missed detection and false detection will also increase, which will greatly increase the workload of workers and reduce the circuit board The production efficiency also leads to the inability to guarante

Method used

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  • Multilayer board for V_CUT depth detection by electrical testing
  • Multilayer board for V_CUT depth detection by electrical testing
  • Multilayer board for V_CUT depth detection by electrical testing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] For a four-layer multilayer board, the thickness of the board is required to be 2.0mm. In order to ensure the interlayer thickness, the thickness of the core board is required to contain a copper core board of 0.5mm. According to the requirements of the V-CUT sub-board, the V_CUT excess thickness should be controlled at 0.5-0.7mm, to ensure that the board can be accurately divided and the board is not easy to break. Therefore, according to the requirements, the board thickness is 2.0mm, and the thickness of the finished board after lamination should be controlled within the range of 1.9mm+ / 10%mm. Therefore, it is necessary to use a multi-layer core board or a multi-layer PP sheet laminate structure.

[0034] Add test terminals 2 and terminal connection lines 3 on the outer layer of the multilayer board to ensure that the electrical test can accurately confirm whether V_CUT is leaking. In the laminated structure, at 0.6+ / -0.1mm of the laminated layer Copper foil is place...

Embodiment 2

[0038] refer to image 3 , for a multi-layer board with more than six layers, the number of core boards and PP sheets is large, and there are many types of laminated structure adjustments. Taking the eight-layer board thickness requirement of 2.0mm as an example, according to the requirements, the board thickness is 2.0mm. After pressing, the thickness of the finished board should be controlled within the range of 1.9mm+ / 10%mm. According to the requirements of V-CUT board splitting, the V_CUT excess thickness should be controlled at 0.5-0.7mm to ensure accurate board splitting and not easy to break the board.

[0039] The eight-layer board needs three core boards and at least three PP sheets at the same time, which provides a variety of laminated structures. In order to ensure the thickness between layers, the thickness of the middle core board 8 is controlled according to the copper content of 0.4mm, and the remaining two The core boards are controlled at 0.3mm respectively, ...

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Abstract

The invention provides a multilayer board for V_CUT depth detection through electrical testing. The multilayer board comprises test terminals, terminal connecting lines, a V_CUT depth test line and anetching factor test line; the test terminals are arranged on an outer layer line of an SET delivery unit, the terminal connecting lines are arranged between the test terminals, an inner layer line ofthe SET delivery unit is provided with the V_CUT depth test line, and the VCUT depth test line is connected to the network connecting line of the UNIT unit. According to the invention, for the multilayer board, accurate V_CUT depth control can be realized, V_CUT testing is realized at the same time, and production reworking or scrapping caused by V_CUT leakage is avoided; the trouble of manual detection is reduced, and the production efficiency is improved; the situation that the V_CUT is too deep or too shallow, and consequently the board is broken or cannot be split is avoided; effective etching parameter detection can be effectively carried out on an etching circuit, and the trouble of independent line width and distance detection is avoided.

Description

technical field [0001] The invention relates to a production detection of a multilayer circuit board, in particular to a multilayer board for V_CUT depth detection through electrical testing. Background technique [0002] The circuit board can be called a printed circuit board or a printed circuit board, which makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical layout. With the globalization and miniaturization of production, circuit boards are also developing in the direction of multi-layer and high density. At the same time, high requirements for reducing power consumption are also put forward. Control has also become a key link to reduce scrap and improve quality; after the circuit board is formed, the manufacturer needs to cut the dividing lines with a rotary cutter at a specific position on the circuit board in advance according to the customer's drawing requirements, that ...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0268H05K3/0052
Inventor 郭先锋祝小华
Owner 深圳市强达电路股份有限公司
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