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LED packaging adhesive composition

A technology of LED encapsulation and composition, applied in the direction of adhesives, etc., can solve the problems of incomplete curing, non-curing, red ink leakage, etc., and achieve the effect of improving vulcanization resistance, excellent vulcanization resistance effect, and improving protection ability

Active Publication Date: 2021-01-22
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the refractive index of domestic high-refractive index LED packaging silica gel can reach between 1.50-1.55. Due to the characteristics of the material itself, there are still many problems; one is that the base material of the LED bracket is constantly changing. Various coupling agents that currently exist in the market have been added, but they still cannot fully meet the increasing requirements of the market, especially for large-size stents, when performing reliability and aging performance tests, resulting in product red ink test leakage on some stents During the high-temperature and high-humidity test, water vapor enters the bonding interface between the silver and the encapsulant, and the discoloration of the silver layer leads to excessive light decay. The second is that the platinum catalyst used contains N, S, P and other elements because the bracket and the use environment Easy to produce incomplete curing or even non-curing phenomenon

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022]Component A includes in parts by weight: 50 parts of the A-component phenyl vinyl MQ silicone resin, the molecular formula is: (Me3SiO1 / 2)1(Ph2SiO)x(SiO2)y(PhViSiO)z; Among them, x is 10, y is 5, z=5, the synthesis method is as follows: 122.18g of diphenyl dimethoxy siloxane, 81.52g of vinyl phenyl dimethoxy siloxane, added to In a three-necked flask, add 1000ppm of concentrated sulfuric acid and add pure water dropwise at 50°C. After the dropwise addition is completed, keep the temperature for 1 hour and then cool to 25°C. Then add 104.165g of ethyl orthosilicate dropwise. Keep the temperature within 30°C during the dropping process. After the addition is complete, add 5.05g of methyl double-head caps, heat up to 60°C for 2h, heat up to 90°C for 3h, then heat up to 120°C for 4h, cool to room temperature, add 5g of calcium carbonate and stir for 1h, filter under positive pressure A colorless and transparent liquid resin is obtained, namely phenyl vinyl MQ silicone resin; 10 pa...

Embodiment 2

[0031]The component A includes in parts by weight: the A component phenyl vinyl MQ silicone resin, the molecular formula is: (Me3SiO1 / 2)1(Ph2SiO)x(SiO2)y(PhViSiO)z; Among them, x is 10, y is 5, z=5, the synthesis method is as follows: 244.36g of diphenyl dimethoxy siloxane, 162.3g of vinyl phenyl dimethoxy siloxane, added to In a three-necked flask, add 1000ppm of concentrated sulfuric acid and add pure water dropwise at 50°C. After the dropwise addition is completed, keep the temperature for 1 hour and then cool to 25°C, then add 208.33g of ethyl orthosilicate dropwise, keeping the temperature within 30°C during the dropping process After the addition is complete, add 5.05g of methyl double-head caps, heat up to 60°C for 2h, heat up to 90°C for 3h, then heat up to 120°C for 4h, cool to room temperature, add 5g of calcium carbonate and stir for 1h, filter under positive pressure A colorless and transparent liquid resin is obtained, namely phenyl vinyl MQ silicone resin; 10 parts of ...

Embodiment 3

[0040]Component A includes in parts by weight: the A component phenyl vinyl MQ silicone resin, the molecular formula is: (Me3SiO1 / 2)1(Ph2SiO)x(SiO2)y(PhViSiO)z; Among them, x is 10, y is 5, z=5, the synthesis method is as follows: 244.36g of diphenyldimethoxysiloxane and 81.52g of vinylphenyldimethoxysiloxane are added to In a three-necked flask, add 1000ppm of concentrated sulfuric acid and add pure water dropwise at 50°C. After the dropwise addition is completed, keep the temperature for 1 hour and then cool to 25°C, then add 208.33g of ethyl orthosilicate dropwise, keeping the temperature within 30°C during the dropping process After the addition is complete, add 5.05g of methyl double-head caps, heat up to 60°C for 2h, heat up to 90°C for 3h, then heat up to 120°C for 4h, cool to room temperature, add 5g of calcium carbonate and stir for 1h, filter under positive pressure A colorless and transparent liquid resin is obtained, namely phenyl vinyl MQ silicone resin; 10 parts of phe...

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Abstract

The invention relates to an LED packaging adhesive composition, which is prepared by mixing a component A and a component B according to a weight ratio of 1:1, wherein the component A comprises the following components in parts by weight: 50-60 parts of phenyl vinyl MQ silicon resin, 10-20 parts of methyl phenyl vinyl silicone oil and 0.1-0.3 part of an anti-poisoning platinum catalyst, and the component B comprises the following components in parts by weight: 50-70 parts of methyl phenyl hydrogen-containing silicone resin, 30-50 parts of methyl phenyl hydrogen-containing silicone oil and 0.1-0.3 part of an inhibitor.

Description

Technical field[0001]The invention relates to an LED packaging glue composition, which belongs to the field of organic silicon.Background technique[0002]Semiconductor lighting based on LED technology has the characteristics of high efficiency, energy saving, environmental protection, long life, and easy maintenance. It is known as the new light source of the 21st century. However, with the development of high-power LED devices, new requirements have been put forward for the refractive index and reliability of packaging materials.[0003]At present, the refractive index of domestic high-refractive-index LED packaging silicone can reach between 1.50 and 1.55. Due to the characteristics of the material itself, there are still many problems; one is that the substrate of the LED bracket is constantly changing, although the high-refractive Various coupling agents currently in the market are added to the current market, but they still cannot fully meet the increasing market requirements. Esp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C08G77/20C08G77/06C08G77/12
CPCC09J183/04C08G77/20C08G77/06C08G77/12C08L2203/206C08L2205/025C08L2205/035C08G77/70C08G77/80C08G2190/00C08L83/04
Inventor 徐庆锟王建斌徐友志陈田安
Owner YANTAI DARBOND TECH
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