Method and device for locally electroplating gold as well as product
A technology of partial electroplating and electroplating gold, applied in the field of partial electroplating of gold, can solve the problems of damaged appearance, poor bonding force, low hardness, etc.
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[0010]In the first aspect, the present invention provides a method of partial gold electroplating.
[0011]A method for partial gold electroplating, comprising the following steps: S10, connecting a workpiece to be partially electroplated with a gold layer to a cathode, immersing it in an electroplating tank equipped with an anode and electroplating solution, and pre-electroplating a layer of 0.01-0.03 on the surface of the workpiece μm thick gold layer; S20, an electrically insulating shielding part is placed oppositely in the to-be-shielded area of the workpiece, and electroplating is performed, and there is a gap between the shielding part and the to-be-shielded area of the workpiece; an electrically insulating shielding part is used The workpiece can be partially electroplated, and the thickness of the electroplated layer in the shielded area on the workpiece is thinner than that in the non-shielded area, which can reduce the thickness of the gold-plated layer in the shielded a...
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