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Method and device for locally electroplating gold as well as product

A technology of partial electroplating and electroplating gold, applied in the field of partial electroplating of gold, can solve the problems of damaged appearance, poor bonding force, low hardness, etc.

Inactive Publication Date: 2021-01-22
SHENZHEN HONGGANG MECHANISM & EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high price of gold, the application is limited
[0003] CN104582299A discloses a method of partially shielding electroplating by using a film, but this method has the following disadvantages: (1) the film is easily washed off in the early washing process
(2) Because there is a level difference at the boundary between the film-attached part and the part where the surface of the workpiece is exposed, it is difficult to completely remove the treatment solution remaining at the level difference in the washing process, and impurities are likely to remain after electroplating Streaks not only detract from the appearance, but also have structural problems such as corrosion from this part
(3) The method of sticking the film can only completely shield the shielding area, and cannot reduce the thickness of the gold plating
[0004] In the prior art, direct current electroplating is used for electroplating gold, but direct current electroplating has problems such as poor bonding force, low hardness, poor wear resistance, low ability to withstand dynamic loads and impacts, etc.

Method used

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  • Method and device for locally electroplating gold as well as product
  • Method and device for locally electroplating gold as well as product
  • Method and device for locally electroplating gold as well as product

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Embodiment Construction

[0010]In the first aspect, the present invention provides a method of partial gold electroplating.

[0011]A method for partial gold electroplating, comprising the following steps: S10, connecting a workpiece to be partially electroplated with a gold layer to a cathode, immersing it in an electroplating tank equipped with an anode and electroplating solution, and pre-electroplating a layer of 0.01-0.03 on the surface of the workpiece μm thick gold layer; S20, an electrically insulating shielding part is placed oppositely in the to-be-shielded area of ​​the workpiece, and electroplating is performed, and there is a gap between the shielding part and the to-be-shielded area of ​​the workpiece; an electrically insulating shielding part is used The workpiece can be partially electroplated, and the thickness of the electroplated layer in the shielded area on the workpiece is thinner than that in the non-shielded area, which can reduce the thickness of the gold-plated layer in the shielded a...

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PUM

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Abstract

The invention provides a method and device for locally electroplating gold as well las a product. The method adopts two-way pulse square wave current; an insulated shielding part is additionally arranged for electroplating after a gold layer which is 0.01-0.03 micron thick is precoated on a workpiece; and the method can reduce the thickness of the coated gold layer in a shielding region, saves usage of gold, and is consistent and uniform in coated gold layer. The method for locally electroplating gold is simple to operate and is low in cost.

Description

Technical field[0001]The invention relates to the field of electroplating, in particular to a method, device and product for partial electroplating of gold.Background technique[0002]Electroplating gold has a history of more than two hundred years. The gold plating layer has a golden yellow appearance, has good chemical stability, discoloration resistance, electrical conductivity, corrosion resistance and oxidation resistance. At the same time, it has good solderability, low contact resistance, and excellent hot-press bonding performance, which makes electroplating gold The coating can be used as a decorative coating as well as a functional and protective coating. Therefore, electroplating gold is widely used in jewelry, clocks, handicrafts, and electronics, instruments, meters, aviation, aerospace and other industrial fields. Gold is a very expensive coating. It has a very low resistivity and because it does not form surface oxides, it can provide very low surface contact resistance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D5/18C25D3/48C25D17/00
CPCC25D5/022C25D5/18C25D3/48C25D17/00
Inventor 孙志明郭志平
Owner SHENZHEN HONGGANG MECHANISM & EQUIP