Packaging substrate, flip chip packaging structure and manufacturing method thereof
A technology for packaging substrates and packaging structures, which is used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., and can solve problems such as collision of external heat sinks, chip failure, and short circuit.
Pending Publication Date: 2021-01-26
SUZHOU TF AMD SEMICON CO LTD
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Problems solved by technology
At present, the best heat-conducting material in the industry is indium sheet. When indium sheet is used as a heat-conducting material, the chip undergoes high-temperature reflow during ball planting and subsequent PCB board. The temperature is higher than the melting point of indium sheet, and the melted indium sheet will be sputtered to passive Components, corrosion of passive components, resulting in chip failure
In addition, with the improvement of chip heat dissipation requirements, the thickness of the chip continues to decrease. The thickness of the existing chip is already lower than the height of the passive components. The passive components higher than the chip are very easy to collide with the external radiator and cause a short circuit.
Method used
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[0025]The application will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the related invention, but not to limit the invention. In addition, it should be noted that, for ease of description, only the parts related to the invention are shown in the drawings.
[0026]It should be noted that the embodiments in the application and the features in the embodiments can be combined with each other if there is no conflict. Hereinafter, the present application will be described in detail with reference to the drawings and in conjunction with embodiments.
[0027]figure 2 withimage 3 The schematic diagram of the structure of the packaging substrate provided by the present application is shown.
[0028]The package substrate includes: a substrate body 201; at least one passive component 202, the at least one passive component 202 is fixedly connected to the front surface of th...
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The invention relates to the technical field of semiconductor manufacturing, and discloses a packaging substrate, a flip chip packaging structure and a manufacturing method thereof, the packaging substrate comprises a substrate body and at least one passive component, each passive component is coated with a high-temperature-resistant bottom sealing adhesive, the bottom sealing adhesive is coated with a high-temperature-resistant conformal coating adhesive, and each passive component is protected. The bottom sealing adhesive is good in liquidity and low in thixotropic index, and the conformal coating adhesive is poor in liquidity and high in thixotropic index, so that bridging of pins at the bottom and the top of the passive component caused by erosion can be prevented, and short circuit caused by collision between the passive component and an external radiator can also be prevented. The chip can be thinned, and the chip can also be connected with an external heat dissipation module through the indium sheet, so that the heat dissipation performance is ensured.
Description
Technical field[0001]The present invention generally relates to the technical field of semiconductor manufacturing, and specifically relates to a packaging substrate, a flip chip packaging structure and a manufacturing method thereof.Background technique[0002]Such asfigure 1 As shown, the existing BGA flip chip products mainly include a substrate body 101, a bottom sealant, a chip 103, a passive component 102, a reinforcement sheet, a thermally conductive interface material 104 and a solder ball 105. The passive components of the package structure are exposed, and are susceptible to erosion and impact from external forces. With the continuous improvement of the heat dissipation performance of the chip, general thermal grease cannot meet the demand. At present, the best thermal conductive material in the industry is indium sheet. When indium sheet is used as a thermally conductive material, the chip undergoes high temperature reflow during ball planting and subsequent PCB board. The ...
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IPC IPC(8): H01L23/498H01L23/31H01L21/56
CPCH01L23/49816H01L23/49838H01L23/3128H01L21/563H01L2924/15311H01L2224/73253H01L2924/19105H01L2924/16152
Inventor 卢玉溪曾昭孔陈武伟黄柏荣
Owner SUZHOU TF AMD SEMICON CO LTD