Air floatation platform for semiconductor wafer laser cutting
A technology of laser cutting and air-floating platform, applied in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., can solve problems affecting product processing quality, etc., achieve novel structure, increase motion rigidity and stability, design unique effect
Active Publication Date: 2021-03-30
SUZHOU DELPHI LASER
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Problems solved by technology
For thinner silicon wafer products, such an error level affects the processing quality of the product
Method used
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[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0050] It should be noted that like numerals and let...
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Abstract
The invention relates to an air flotation platform for laser cutting of semiconductor wafers. X-axis guide rail 1 and X-axis guide rail 2 are arranged on a marble base. Orifice 1, the side of the groove of the X-axis air bearing guide moving part is provided with an air bearing side positive pressure orifice 1; the X-axis air bearing guide moving part is connected with the Y-axis SiC beam through a flexible connector, and the X-axis guide rail One is equipped with X-axis magnet steel one, one end of Y-axis SiC beam is equipped with X-axis coil one, X-axis guide rail two is equipped with X-axis magnet steel two, and the other end of Y-axis SiC beam is equipped with X-axis coil two; Y-axis air float The guide moving part is matched with the Y-axis SiC beam. There is negative pressure cavity 1 in the middle of the bottom surface, and the air flotation horizontal direction positive pressure orifice 2 is set on the bottom surface; The positive pressure orifice 2; the bottom surface of the Y-axis SiC beam is equipped with an X-axis air bearing horizontal guide. Stable operation and high precision.
Description
technical field [0001] The invention relates to an air floating platform for semiconductor wafer laser cutting, which belongs to the technical field of laser processing. Background technique [0002] The precision positioning platform is one of the key components in precision mechanical equipment. It provides a loading platform capable of precise positioning and precise movement for the fields of microlithography, numerical control machining, biotechnology, and nanometer surface topography measurement. The precision air-floating platform based on air-floating support and linear motor linear drive technology is a hot spot in the research of high-precision technology at home and abroad. The linear drive air flotation platform is a mechatronic system, a comprehensive technology integrating linear drive technology, numerical control technology, dynamic and static characteristic analysis and optimization, automatic control principle, testing and experimental analysis. In the fie...
Claims
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IPC IPC(8): B23K26/38B23K26/402B23K26/08
CPCB23K26/0853B23K26/38B23K26/402B23K2103/56
Inventor 赵裕兴李军高峰
Owner SUZHOU DELPHI LASER