Machine table for wafer cleaning machine

Abstract

Disclosed is a machine table for a wafer cleaning machine. The machine table comprises a rotating base, a protective gas pipeline is inserted into the center of the rotating base, a bearing sleeve isfixed to the upper end of the rotating base, an outer groove and an inner groove are formed in the bearing sleeve, an annular pressing pad and an air bag ring are installed in the inner groove, and the air bag ring is communicated with an air pipe with an opening valve; an air outlet groove is formed in the center of the rotating base and provided with a buffer baffle with air holes in the air outlet direction of the protective gas pipeline. The machine table is reasonable in structural design, the bearing sleeve is optimized, the inner groove is additionally formed on the basis of a traditional outer groove, the annular pressing pad and the air bag ring are installed in the inner groove, the air bag ring serves as a hoop after being inflated, a wafer is effectively clamped in the rotatingbase, and smooth cleaning is guaranteed; moreover, the height position of a rectifying baffle is adjustable, air holes are reasonably distributed, and the protective gas filling requirement is met.

Description

technical field [0001] The invention relates to the technical field of wafer production equipment, in particular to a wafer cleaning machine platform. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. The raw material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon. Silicon is refined from quartz sand, and the wafer is purified by silicon elements. Then these pure silicon are made into silicon crystal rods, which become the material of quartz semiconductors for manufacturing integrated circuits. After photolithography, grinding, polishing, and slicing Waiting for the procedure, the polysilicon is melted and pulled out of the monocrystalline silic...

AI Technical Summary

Problems solved by technology

However, there are still deficiencies in the use of the wafer cleaning machine. One is that the chuck cannot effectively clamp the wafer, which causes the wafer to be easily displaced under pressure after the protective gas is filled; the other is rectification. The position of the baffle cannot be adjusted according to the demand

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