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Backlight module and manufacturing method thereof

A technology of a backlight module and a manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as complex manufacturing processes of light-emitting diode display devices, improve process efficiency, reduce etching times, and simplify The effect of craft difficulty

Active Publication Date: 2022-03-08
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] This application provides a backlight module and its manufacturing method to solve the technical problems of complex manufacturing process of existing light-emitting diode display devices

Method used

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  • Backlight module and manufacturing method thereof
  • Backlight module and manufacturing method thereof
  • Backlight module and manufacturing method thereof

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Embodiment Construction

[0058] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0059] The manufacturing process of the existing backlight module usually requires multiple photomasks and multiple times of wet and dry etching to form, and too many times of etching increases the process difficulty of the backlight module, resulting in an increase in cost.

[0060] see figure 1 ~ Fig. 3, the present application proposes a manufacturing method of a backlight module 100, which includes:

[0061] S10, forming a first conducti...

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Abstract

The present application proposes a method for manufacturing a backlight module, including: forming a first conductive layer and a first insulating layer on a substrate; forming an active material layer on the first insulating layer; using a multi-stage mask patterning the first insulating layer and the active material layer to expose part of the first conductive layer, and making the active material layer form an active component; forming a third conductive layer on the active component , to form the source and drain of the backlight module. In this application, a multi-segment mask is used to simultaneously form the active component and the opening of the first electrode of the binding terminal of the flexible circuit board, so that the third conductive layer can simultaneously form the source and drain electrodes and the opening of the binding terminal of the flexible circuit board. The second electrode and the binding end of the light-emitting element reduce the etching times of the manufacturing process, simplify the process difficulty of the backlight module, and improve the process efficiency.

Description

technical field [0001] The present application relates to the field of display, and in particular, to a backlight module and a manufacturing method thereof. Background technique [0002] The backlight module of the existing light-emitting diode display device usually includes a driving circuit board and light-emitting diodes, such as Micro LED or Mini LED, located on the driving circuit board. Therefore, the structural design of the backlight module is particularly important for high-resolution products. [0003] Metal oxide has the advantages of high mobility, adaptability to low temperature process, excellent uniformity and surface flatness, so this material is often used in the production of backplanes. For the traditional back channel etch structure, it usually requires a 4-to-mask process, and two metal layers that form the bond terminals are bridged by indium tin oxide. However, due to the large resistance of indium tin oxide and easy aging, it leads to uneven display...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/77H01L27/12H01L27/15
CPCH01L27/124H01L27/1288H01L27/156
Inventor 刘俊领
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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