Chemical mechanical polishing method and device

Abstract

The invention discloses a chemical mechanical polishing method and a device. The method comprises the following steps that a semiconductor wafer to be polished is provided; a chemical mechanical polishing process is carried out on the semiconductor wafer, and the semiconductor wafer is located on a first plane in the chemical mechanical polishing process; and a suspension processing step is carried out on the semiconductor wafer, the semiconductor wafer is located on a second plane higher than the first plane and the portion below the surface of the semiconductor wafer is suspended in the suspension processing step, and wherein the semiconductor wafer rotates in the suspension processing step. According to the invention the chemical mechanical polishing method and the device, the semiconductor wafer is lifted to a certain height to be far away from a polishing pad for the suspension processing step, so that the semiconductor wafer rotates, a polishing solution on the surface of the semiconductor wafer, polishing particles in the polishing solution and the polishing by-products are separated from the surface of the semiconductor wafer, and therefore, the polishing solution particlesand the polishing by-products adhered to the surface of the wafer are prevented from influencing subsequent processing steps.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chemical mechanical polishing method and device. Background technique [0002] In the process of semiconductor manufacturing, from the manufacture of the wafer to the formation of the device, there are many steps of performing chemical mechanical polishing on the semiconductor wafer. In the process of chemical mechanical polishing of semiconductor wafers, since the polishing fluid used contains a large amount of particles, and at the same time, it will produce by-products, consumable debris and other residues during the chemical mechanical polishing process, these substances will adhere to the semiconductor wafer. round surfaces such as figure 1 As shown, after the polishing head 101 supports the semiconductor wafer 100 to perform a chemical mechanical polishing process on the surface of the polishing pad 102, since the surface of the polishing pad needs to spray the po...

AI Technical Summary

Problems solved by technology

During the rough polishing process, the polishing liquid particles and polishing by-products attached to the surface of the semiconductor wafer will affect the effect of the subsequent fine polishing

For another example, during the cleaning process after the chemical mechanical polishing process of the semiconductor wafer is completed, the polishing liquid particles and polishing by-products attached to the surface of the semiconductor wafer are brought into the cleaning unit, which affects the cleaning effect

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