Etching processing method of conductive partition plate with gas-liquid distribution flow field
A separation plate and flow field technology, applied in the field of electrochemistry, can solve problems such as high positioning accuracy requirements, high positioning accuracy requirements, and increased processing costs, to achieve assembly quality and positioning accuracy assurance, reduce leakage risks, and simplify assembly The effect of craft
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[0049] This embodiment provides a method for etching a conductive separator plate with a gas-liquid redistribution flow field structure, including the following steps:
[0050] 1. Coating protective layer: Coating a resin protective layer on the surface of the metal plate, the coating thickness is kept at 0.5mm; and drying treatment is carried out, the drying condition is 80°C, 30min;
[0051] 2. Exposure and development: Cover the area to be etched with a development template, and expose the area to be protected with ultraviolet light to cure the resin in this area. The exposure time is 10 minutes, and then clean the plate with toluene detergent to remove the uncured resin.
[0052] 3. Initial etching: send the metal device coated with the cured resin protective layer into the etching machine for etching, the pressure of the etching liquid sprayed from the nozzle of the etching machine is 1.0psi, the etching time is 10min, and the concentration of the etching liquid is 20wt.%H...
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