Method for reducing thermal crosstalk in 3D cross-point memory array using laminated gap filling

Abstract

A system, method, and apparatus capable of reducing the amount of thermal crosstalk between cells in a three-dimensional array of memory cells through the use of laminated materials are described, which in turn allow smaller scale manufacturing of memory cells.

Description

technical field [0001] In general terms, the present disclosure relates to three-dimensional electronic memory. More specifically, the present disclosure relates to the use of laminates in the geometry of a three-dimensional memory array to increase certain characteristics or properties of the memory array or to reduce undesired characteristics in the memory array. Background technique [0002] Planar memory cells are scaled to smaller sizes by improving process technology, circuit design, programming algorithms, and manufacturing processes. However, as the feature size of memory cells approaches the lower limit, planar processes and fabrication techniques become challenging and expensive. Therefore, the memory density of planar memory cells approaches the upper limit. Three-dimensional (3D) memory architectures can address the density limitations of planar memory cells. Contents of the invention [0003] In creating the techniques of the present invention, it was recog...

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Problems solved by technology

However, as the feature size of memory cells approaches the lower limit, planar processes and fabrication techniques become challenging and expensive

Therefore, the memory density of planar memory cells approaches the upper limit

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