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Novel conductive film, preparation method thereof and touch screen

A conductive film, touch screen technology, applied in chemical instruments and methods, electronic equipment, flat products, etc., can solve the problems of poor back-end line adhesion, limited size of the middle visible area, etc., to achieve strong adhesion , excellent performance, not easy to release the effect of the film

Pending Publication Date: 2021-02-19
JIANGSU RIJIU OPTOELECTRONICS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the back-end circuits are all printed around the touch screen through a post-printing process, and the line width of the back-end circuits printed in the later stage is relatively wide, and the line width is greater than 25 μm, resulting in a limited size of the middle visible area, and Printed back-end lines have poor adhesion

Method used

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  • Novel conductive film, preparation method thereof and touch screen
  • Novel conductive film, preparation method thereof and touch screen

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The substrate layer 10 is a PET layer, COP layer, PI layer or PC layer with a thickness of 6-200um; the underlying layer 12 is a silicon oxide layer with a thickness of 12nm; the touch layer 13 in the visible area is an indium tin oxide layer with a thickness of 22nm; the connection layer 14 is a simple silicon layer with a thickness of 5nm; the frame wiring metal layer 15 is a copper layer with a thickness of 150nm; the anti-oxidation layer 16 is a copper-nickel-titanium alloy layer with a thickness of 6nm; the other side of the substrate layer 10 A PET protective film 11 is pasted on it, and a CPP protective film 17 is pasted on the frame wiring metal layer 15. The performance results at this time: the impedance is 0.12Ω, and the adhesion is 5B.

Embodiment 2

[0034] The substrate layer 10 is a PET layer, a COP layer, a PI layer or a PC layer with a thickness of 6-200um; the underlying layer 12 is a silicon oxide layer with a thickness of 15nm; the touch layer 13 in the visible area is an indium tin oxide layer with a thickness of 21nm; the connection layer 14 is a single silicon layer and an aluminum oxide layer, with a thickness of 15nm; the frame wiring metal layer 15 is a copper layer, with a thickness of 185nm; the anti-oxidation layer 16 is a copper-nickel-titanium alloy layer, with a thickness of 15nm; the substrate layer A PET protective film 11 is pasted on the other side of 10 , and a CPP protective film 17 is pasted on the metal layer of the frame wiring. The performance results at this time: the impedance is 0.1Ω, and the adhesion is 5B.

Embodiment 3

[0036]The substrate layer 10 is a PET layer, a COP layer, a PI layer or a PC layer with a thickness of 6-200um; the underlying layer 12 is a silicon oxide layer with a thickness of 15nm; the touch layer 13 in the visible area is an indium tin oxide layer with a thickness of 21nm; the connection layer 14 is an aluminum oxide layer with a thickness of 1nm; the frame wiring metal layer 15 is a copper layer with a thickness of 185nm; the anti-oxidation layer 16 is a copper-nickel-titanium alloy layer with a thickness of 45nm; the other side of the substrate layer 10 A PET protective film 11 is pasted on it, and a CPP protective film 17 is pasted on the metal layer of the frame wiring. The performance results at this time: the impedance is 0.1Ω, and the adhesion is 5B.

[0037] From the comparison of the experimental data, it can be concluded that when alumina is used as the connecting layer, it has better adhesion.

[0038] The following table takes Example 3 as an example, and co...

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Abstract

The invention discloses a novel conductive film, a preparation method thereof and a touch screen. The novel conductive film comprises a substrate layer, a screen function layer which is arranged on one surface of the substrate layer and can be used for manufacturing the touch screen through etching, and a frame wiring function layer which can be used for manufacturing a rear-end circuit through etching, wherein the frame wiring functional layer is plated on the screen functional layer through a magnetron sputtering process, and the frame wiring functional layer comprises a frame wiring metal layer. The frame wiring functional layer is plated on the screen functional layer in a film plating mode, the frame wiring functional layer is etched into a conducting circuit rear-end circuit throughcorresponding etching liquid, and a touch screen manufactured through the novel conducting film has the line width advantage, the line width can be narrowed to 3-10 [mu]m, the adhesive force is high,film stripping is not likely to happen, and the performance is better.

Description

technical field [0001] The invention relates to a novel conductive film, a preparation method thereof and a touch screen. Background technique [0002] The conductive film in the prior art can usually only be used to make the touch screen in the visible area. Various conductive films can achieve various functional effects, such as smooth touch, sensitive response, and color rendering. Excellent effect, good tactile smoothness and so on. When making the touch screen, a back-end line is arranged around the touch screen, the back-end line is electrically connected to the touch screen, and the back-end line is electrically connected to the FPC. However, in the prior art, the back-end circuits are all printed around the touch screen through a post-printing process, and the line width of the back-end circuits printed in the later stage is relatively wide, and the line width is greater than 25 μm, resulting in a limited size of the middle visible area, and Printed back-end wiring...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B15/04B32B15/085B32B15/20B32B27/06B32B27/32B32B27/36B32B33/00G06F3/041B29D7/01
CPCB32B27/06B32B9/00B32B9/045B32B15/04B32B15/085B32B15/20B32B27/36B32B27/32B32B33/00G06F3/0412B29D7/01B32B2457/208G06F2203/04103
Inventor 高毓康吕敬波胡业新刘世琴宋尚金
Owner JIANGSU RIJIU OPTOELECTRONICS LTD
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