Temperature compensation packaging-free surface acoustic wave device and preparation method thereof
A surface acoustic wave device, temperature compensation technology, applied in electrical components, impedance networks, etc., can solve the problems of cavity structure collapse, moisture, increase device volume, etc., to achieve the effect of improving yield and reducing cost
Pending Publication Date: 2021-02-19
TSINGHUA UNIV
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Problems solved by technology
However, such a structure will increase the difficulty of device preparation and increase the cost; at the same time, the design of the cavity structure will have the risk of substandard products such as collapse and moisture, which will affect the product yield; in addition, the packaging structure increases the device volume and hinders further miniaturization of the device
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Embodiment 1
[0072] Example 1. Preparation of temperature-compensated package-free surface acoustic wave devices
[0073] Such as figure 2 Shown is a schematic structural diagram of a temperature-compensated package-free surface acoustic wave device of the present invention, and its preparation method is carried out according to the following steps:
[0074] 1. Use a high-resistance (100) Si substrate with a thickness of 500 μm, clean it sequentially with acetone, alcohol, deionized water, and alcohol ultrasonically, and then dry it with a nitrogen gun.
[0075] 2. On the high-resistance (100) Si substrate, 300nm zinc oxide is grown by magnetron sputtering. The specific experimental conditions are: the background vacuum is better than 8×10 -5 Pa, using Zn target reactive sputtering, using RF power supply, power supply 140W, Ar flow rate 18sccm, O 2 The flow rate is 10sccm, the coating temperature is 350°C, the coating pressure is 0.8Pa, and the coating time is 2250s.
[0076] 3. The i...
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Abstract
The invention discloses a temperature compensation packaging-free surface acoustic wave device and a preparation method thereof. The temperature compensation packaging-free surface acoustic wave device sequentially comprises a substrate, an interdigital transducer, a silicon dioxide layer and a high-sound-velocity layer from bottom to top, wherein the substrate comprises a piezoelectric single crystal substrate and / or a substrate on which a strong texture piezoelectric film grows; when the substrate is a conventional substrate on which the strong texture piezoelectric film grows, arranging thesilicon dioxide layer on one surface on which the strong texture piezoelectric film grows; and arranging the silicon dioxide layer on the substrate and covering the interdigital transducer and an adjacent interdigital gap thereof. According to the temperature compensation packaging-free surface acoustic wave device, the high-sound-velocity layer covers the device so that the upward propagation ofsound waves is restrained, packaging-free performance of the device can be achieved, and then improvement of the surface acoustic wave device in the aspects of cost reduction, yield improvement, device miniaturization promotion and the like is promoted; by using a mature method for preparing each functional layer in the temperature compensation surface acoustic wave device, the quality of the device is ensured while the temperature stability of the device is improved.
Description
technical field [0001] The invention relates to a temperature-compensated package-free surface acoustic wave device and a preparation method thereof, belonging to the field of electronic information materials. Background technique [0002] With the development of communication technology, surface acoustic wave devices are developing rapidly in the direction of high frequency, high performance, low cost, and miniaturization. Traditional surface acoustic wave devices usually need to adopt a package structure, and design the cavity in the package structure to ensure the stability of device performance. However, such a structure will increase the difficulty of device preparation and increase the cost; at the same time, the design of the cavity structure will have the risk of substandard products such as collapse and moisture, which will affect the product yield; in addition, the packaging structure increases the device volume and hinders further miniaturization of the device . ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H03H3/10H03H9/02H03H9/145H03H9/25
CPCH03H3/10H03H9/02559H03H9/02622H03H9/02834H03H9/14511H03H9/25
Inventor 潘峰沈君尧曾飞傅肃磊苏荣宣徐惠平
Owner TSINGHUA UNIV