Preparation method of sectional type black solder strip and sectional type black solder strip
A segmented, black technology, applied in the direction of final product manufacturing, sustainable manufacturing/processing, photovoltaic power generation, etc., can solve problems such as accumulation cracks, damage to the uniformity of black coating, and failure of cell docking, so as to avoid damage , Avoid the effects of stacking cracks and cell butt joint failure
Inactive Publication Date: 2021-02-23
LONGI SOLAR TECH (TAIZHOU) CO LTD
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Problems solved by technology
[0004] When welding with the above-mentioned black ribbon, the low-melting-point alloy layer is heated and melted, and the low-melting-point alloy layer in a molten state between the high-conductivity substrate and the black coating will flow, and the flowing low-melting-point alloy layer will destroy the black The uniformity of the coating, which in turn leads to problems such as stacking cracks and cell butt joint failure
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[0029] The specific implementation manners according to the present invention will be described below in conjunction with the accompanying drawings.
[0030] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, therefore, the present invention is not limited to the specific embodiments disclosed below limit.
[0031] Such as figure 1 and figure 2 As shown, the existing black soldering strip includes a conductive base strip 10, a low-melting-point alloy layer 20 plated on the upper surface and a lower surface of the conductive base strip 10, and a low-melting-point alloy layer 20 alternately sprayed on the upper surface and the lower surface in turn. Several segments of black coating 30 .
[0032] During welding, the low-melting-point alloy layer 20 positioned on the lower surface of the black ribbon is in cont...
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Abstract
The invention provides a preparation method of a sectional type black solder strip. The method comprises the following steps: providing a conductive base strip, and alternately setting a plurality ofsections of spraying areas on the upper surface and the lower surface of the conductive base strip in sequence; performing spraying in each section of spraying area to form a black coating; and plating a low-melting-point alloy layer on the conductive base strip opposite to the black coating. The melting point of the low-melting-point alloy layer is lower than that of the black coating. The melting point of the black coating is higher than that of the low-melting-point alloy layer, so that heat generated during welding cannot damage the structure of the black coating; moreover, the black coating is in direct contact with the conductive base strip opposite to the low-melting-point alloy layer, so that compared with an existing black solder strip, no molten and flowing low-melting-point alloy exists between the black coating and the conductive base strip; the damage to the uniformity of the black coating can be effectively avoided, and the problems of stacking cracking, battery piece butt joint failure and the like are further solved. The invention further provides a sectional type black solder strip.
Description
technical field [0001] The invention relates to the technical field of photovoltaic modules, in particular to a method for preparing a segmented black soldering strip and the segmented black soldering band. Background technique [0002] The all-black photovoltaic module refers to the frame, the back cover and the welding ribbon connected to the cell are all black. Because the all-black photovoltaic module has good anti-glare characteristics, it is one of the main directions for the development of photovoltaic modules. [0003] Existing black ribbons used for docking cells generally include high-conductivity substrates, such as copper, tin-plated copper, tin-lead-plated copper, galvanized copper or nickel-plated copper, etc., which are wrapped on the upper and lower surfaces of the high-conductivity substrate. The low-melting-point alloy layer on the surface, such as tin-lead alloy, and the black coating alternately sprayed on the upper-surface low-melting-point alloy layer a...
Claims
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IPC IPC(8): H01L31/18H01L31/05
CPCH01L31/188H01L31/0504H01L31/0512Y02E10/50Y02P70/50
Inventor 赵小强何志富朱琛吕俊谭小春
Owner LONGI SOLAR TECH (TAIZHOU) CO LTD