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SESAM and optical fiber coupling structure and packaging method

A technology of coupling structure and packaging method, which is applied in the laser field, can solve the problems of short lifespan of SESAM, and achieve the effect of facilitating mass production, improving stability, and compact volume

Active Publication Date: 2021-02-26
HUAZHONG PHOTOELECTRIC TECH INST (CHINA SHIPBUILDING IND CORP THE NO 717 INST)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Aiming at the technical problems existing in the prior art, the present invention provides a coupling structure and packaging method of SESAM and optical fiber, which solves the problem of short service life of SESAM in the application of optical fiber ultrafast oscillators in the prior art

Method used

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  • SESAM and optical fiber coupling structure and packaging method
  • SESAM and optical fiber coupling structure and packaging method
  • SESAM and optical fiber coupling structure and packaging method

Examples

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Effect test

Embodiment 1

[0052] Embodiment 1 provided by the present invention is an embodiment of the coupling structure of a kind of SESAM and optical fiber provided by the present invention, by figure 1 It can be seen that the embodiment of the coupling structure includes: optical fiber optical path switching device 2, optical fiber 3, plug 4, glass tube 6, SESAM7, adhesive 8, SESAM mount 9, TEC (Thermo Electric Cooler, semiconductor refrigerator) 10, Heat sink 11 and multi-axis mount 12.

[0053] The optical fiber optical path switching device 2 includes an optical fiber optical path at one end and at least one optical fiber optical path at the other end, switches an optical fiber optical path at one end to communicate with any optical fiber optical path at the other end; at least one optical fiber optical path at the other end passes through the corresponding Each optical fiber 3 is plugged into the plug 4 respectively.

[0054] Optical fiber 3 is a polarization-maintaining single-mode fiber or ...

Embodiment 4

[0075] Embodiment 2 provided by the present invention is an embodiment of a packaging method for a SESAM-fiber coupling structure provided by the present invention. The packaging method is based on a SESAM-fiber coupling structure provided in an embodiment of the present invention. Specifically, the Packaging methods include:

[0076] Step 1, inject curing glue into the microholes of the plug 4, set the number of optical fibers 3 according to the requirements, the number is less than or equal to the number of microholes, strip and wipe off the tail coating layer of each optical fiber 3, and then Insert the tails of the optical fiber 3 into the corresponding microholes, and protrude the other end surface of the plug 4 after passing through the plug 4 to cure the curing glue, and then use a grinder to grind the other end surface of the optical fiber 3 passing through the plug 4 Polished to a flat end face, which can be coated or uncoated.

[0077] Step 2, put adhesive on the ra...

Embodiment 3

[0084] Embodiment 3 provided by the present invention is an embodiment of the structure and packaging method of the first specific application embodiment of a SESAM-fiber coupling structure provided by the present invention.

[0085] combine figure 1 and image 3, this embodiment realizes the coupling and packaging method of a single optical fiber and SESAM, including a ceramic plug, a polarization-maintaining single-mode optical fiber, a glass tube, a square SESAM, a heat-conducting adhesive, and a SESAM installation seat, a TEC and a heat sink.

[0086] to combine figure 1 and image 3 , a ceramic plug with an outer diameter of 2mm and a length of 5mm was selected, and there was a microhole with a diameter of 128μm in the center, and heat-cured glue was injected into the microhole.

[0087] to combine figure 1 and image 3 , The optical fiber is a polarization-maintaining single-mode optical fiber with a cladding diameter of 125 μm.

[0088] to combine image 3 After...

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Abstract

The invention relates to a coupling structure and a packaging method of an SESAM (semiconductor saturable absorber mirror) and an optical fiber. The coupling structure comprises an optical fiber optical path switching device, a plug, an SESAM mounting base and a multi-axis mounting frame, wherein the SESAM mounting base is arranged on the optical fiber optical path switching device; the plug comprises micropores, and the optical fiber passes through the micropores from one end face of the plug to the other end face of the plug. The other end surface of the plug and the mirror surface end of the SESAM7 are sealed in a closed space; the SESAM is mounted on the SESAM mounting base, and the multi-axis mounting frame clamps the SESAM mounting base to adjust the relative distance and angle between the mirror surface end of the SESAM and the other end surface of the plug, so that each working point of the SESAM corresponds to the position of each optical fiber passing through the plug; pointchanging work of the SESAM is achieved through switching of the multiple optical fibers, the utilization rate of the SESAM is increased, the service life of the SESAM is obviously prolonged, and the maintenance cost of the laser is reduced. The coupling mode is simple in structure, feasible in operation, low in cost and compact in size, realizes all-fiber and replaceable points of the SESAM, and is very beneficial to batch production of fiber ultrafast lasers.

Description

technical field [0001] The invention relates to the field of laser technology, in particular to a coupling structure and packaging method of a SESAM and an optical fiber. Background technique [0002] Ultrafast fiber lasers generated by SESAM passive mode-locking can generate ultrashort pulses on the order of picoseconds to femtoseconds, which is the current mainstream technical solution for ultrafast oscillators. SESAM integrates the functions of reflector and saturable absorber at the same time. Compared with the previous simple semiconductor saturable absorber, SESAM has many advantages such as convenient self-starting, simple use, and low insertion loss, and has been widely used. [0003] However, although SESAM has achieved great success in the field of ultrafast lasers, it still has not completely solved the shortcomings of low damage threshold, easy damage, and short life, which is very unfavorable for its application in some fields, such as in the need In industrial...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4296G02B6/4254G02B6/4271
Inventor 郑建奎崔索超陈炯
Owner HUAZHONG PHOTOELECTRIC TECH INST (CHINA SHIPBUILDING IND CORP THE NO 717 INST)
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