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Multi-layer body

A technology for lamination and formation of layers, applied in the direction of coating, layered products, metal layered products, etc., can solve the problems of insufficient microcircuit formability and reduced productivity, etc.

Pending Publication Date: 2021-03-02
ARISAWA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thickness of even a thin metal foil is 2 μm, the formation of fine circuits is not sufficient, and there is a problem that productivity decreases

Method used

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Examples

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Embodiment

[0108] Hereinafter, although an Example and a comparative example demonstrate this invention more concretely, this invention is not limited to these Examples.

[0109] Although the synthesis examples of the thermoplastic resin used as the raw material of the resin layer of this invention are demonstrated concretely below, this invention is not limited to these synthesis examples.

[0110]Acid dianhydrides, diamines, and solvents used to synthesize thermoplastic resins are shown below.

[0111] p-PDA: p-phenylenediamine (manufactured by Kanto Chemical Co., Ltd.)

[0112] BAPP: 2,2-bis(4-aminophenoxyphenyl)isopropane (manufactured by Wakayama Seika Kogyo Co., Ltd.)

[0113] TPE-R: 1,3-bis(4-aminophenoxy)benzene (manufactured by Wakayama Seika Kogyo Co., Ltd.)

[0114] 4,4'-DPE: 4,4'-diaminodiphenyl ether (manufactured by Wakayama Seika Kogyo Co., Ltd.)

[0115] BPDA: 3,4,3',4'-biphenyltetracarboxylic dianhydride (manufactured by Ube Industries, Ltd.)

[0116] DMAc: N,N-Dimet...

Synthetic example 1

[0119] After adding 85 g of DMAc, 1.034 g (0.003 mol) of BAPP, and 6.628 g (0.023 mol) of TPE-R to the reaction vessel, it was stirred at room temperature to dissolve BAPP and TPE-R in DMAc. To the resulting solution was slowly added 7.338 g (0.025 mol) of BPDA. Then, it stirred at room temperature for 3 hours, and obtained the resin composition (polyamic acid solution). It diluted with DMAc so that the solid content concentration of the obtained polyamic-acid solution might become 2 mass %, and the polyamic-acid solution A was obtained.

Synthetic example 2

[0121] 85 g of DMAc, 5.645 g (0.014 mol) of BAPP, and 2.680 g (0.009 mol) of TPE-R were added to the reaction container, and stirred at room temperature to dissolve BAPP and TPE-R in DMAc. To the resulting solution was slowly added 6.675 g (0.023 mol) of BPDA. Then, it stirred at room temperature for 3 hours, and obtained the resin composition (polyamic acid solution). It diluted with DMAc so that the solid content concentration of the obtained polyamic-acid solution might become 2 mass %, and the polyamic-acid solution B was obtained.

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Abstract

A multi-layer body comprises: a base material; and a plating formation layer that is arranged on at least one of the two surfaces of the base material and contains a thermoplastic resin and a platingcatalyst. This multi-layer body is configured such that the plating formation layer additionally satisfies the conditions (1) and / or (2) described below. Condition (1): The plating formation layer contains a dispersant for dispersing the plating catalyst. Condition (2): The abundance of the plating catalyst on the front side of the plating formation layer is higher than the abundance of the plating catalyst on the base material side of the plating formation layer.

Description

technical field [0001] The present invention relates to laminated bodies. Background technique [0002] In recent years, along with the high integration of semiconductor circuits, it is required to form finer wiring circuits on printed wiring boards. In order to form a fine wiring circuit, it is necessary to reduce the thickness of the wiring. However, since the thickness is 2 μm even if it is a thin metal foil, there is a problem that the fine circuit formability is not sufficient and the productivity is lowered. [0003] In view of such problems, Patent Document 1 discloses that a polymer film, a plating-forming layer containing a crystalline thermoplastic resin, and a laminate obtained by laminating the plating layer in this order are materials capable of forming fine circuits, In addition, the adhesion between the plating-forming layer and the plating layer and the solder heat resistance can be improved. [0004] prior art literature [0005] patent documents [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/18B32B15/08B32B15/088B32B27/34C23C18/28H05K3/18H05K3/38
CPCB32B15/08B32B15/088B32B27/34B32B27/18C23C18/1653C23C18/165C23C18/31C23C18/2086C25D5/56C23C18/30H05K3/022H05K1/0393H05K3/387H05K2203/0716B32B27/281C23C18/28H05K3/18H05K3/38B32B3/08H05K1/036H05K3/0064H05K3/381H05K2203/061H05K2203/072
Inventor 中村健二今野喜彦松山浩幸田井诚藤田秀一
Owner ARISAWA MFG CO LTD
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