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Low-temperature composite solder alloy soldering lug, and preparation method and use method thereof

An alloy soldering sheet and composite welding technology, which is applied to the composition of low-temperature composite solder alloy soldering sheet, composite soldering sheet, and the field of forming solder joints, can solve the problems of poor mechanical properties, high cost, low melting point, etc., and achieve good plasticity and strength. The effect of lifting and shear strength improvement

Active Publication Date: 2021-03-05
云南锡业集团(控股)有限责任公司研发中心
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the current single low-temperature alloys that are easy to gather bismuth at the interface, form a brittle phase of continuous bismuth, have too low melting point, poor mechanical properties, and high cost, and the welding sheet of the composite structure does not involve the field of low-temperature welding

Method used

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  • Low-temperature composite solder alloy soldering lug, and preparation method and use method thereof
  • Low-temperature composite solder alloy soldering lug, and preparation method and use method thereof
  • Low-temperature composite solder alloy soldering lug, and preparation method and use method thereof

Examples

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Effect test

Embodiment 1

[0039] Embodiment 1: This low-temperature composite solder alloy solder sheet includes a 24.51% high-temperature layer and a 75.49% low-temperature layer, and a layer of low-temperature layers are respectively arranged on both sides of the high-temperature layer, wherein the high-temperature layer welding material is Sn-0.7Cu alloy, and the solidus temperature is 229.3°C, the low-temperature layer welding material is Sn-52In eutectic alloy, and the solidus temperature is 120.5°C;

[0040] The preparation of the above-mentioned low temperature composite solder alloy solder sheet is as follows ( figure 1 ): Sn-0.7Cu alloy and Sn-52In eutectic alloy were pre-rolled into solder pieces with a thickness of 0.25mm and 0.5mm respectively, and the target size was cut out, and alcohol ultrasonic cleaning, dilute hydrochloric acid cleaning, alcohol ultrasonic cleaning, After drying; place a low-temperature layer on both sides of the high-temperature layer to form a sandwich structure, a...

Embodiment 2

[0043]Embodiment 2: This low-temperature composite solder alloy solder sheet includes a 47.72% high-temperature layer and a 52.28% low-temperature layer, and one layer of low-temperature layers is respectively arranged on both sides of the high-temperature layer, wherein the high-temperature layer welding material is Sn-0.7Cu alloy, and the solidus temperature is 229.3°C, the low-temperature layer welding material is Sn-52In eutectic alloy, and the solidus temperature is 120.5°C;

[0044] The preparation of the above-mentioned low-temperature composite solder alloy solder sheet is as follows: the Sn-0.7Cu alloy and the Sn-52In eutectic alloy are pre-rolled into solder sheets with a thickness of 1.00mm and 0.25mm respectively, and the target size is cut out, and cleaned by alcohol ultrasonic , dilute hydrochloric acid cleaning, alcohol ultrasonic cleaning, and drying; place a low-temperature layer on both sides of the high-temperature layer to form a sandwich structure, and put ...

Embodiment 3

[0047] Embodiment 3: The low-temperature composite solder alloy solder sheet includes a 60.1% high-temperature layer and a 39.9% low-temperature layer, and a layer of low-temperature layers is respectively arranged on both sides of the high-temperature layer, wherein the high-temperature layer welding material is Sn-0.7Cu alloy, and the solidus temperature is 229.3°C, the low-temperature layer welding material is Sn-52In eutectic alloy, and the solidus temperature is 120.5°C;

[0048] The preparation of the above-mentioned low-temperature composite solder alloy solder sheet is as follows: respectively pre-roll the Sn-0.7Cu alloy and the Sn-52In eutectic alloy into solder sheets with a thickness of 1.00mm and 0.10mm, cut out the target size, and clean them with alcohol ultrasonic , dilute hydrochloric acid cleaning, alcohol ultrasonic cleaning, and drying; place a low-temperature layer on both sides of the high-temperature layer to form a sandwich structure, and put it into a ro...

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Abstract

The invention provides a low-temperature composite solder alloy soldering lug which comprises a high-temperature layer and low-temperature layers, and the two sides of the high-temperature layer are each provided with one or more low-temperature layers, wherein the solidus temperature of the high-temperature layer is 175-260 DEG C, and the solidus temperature of the low-temperature layers is 60-160 DEG C; In the welding spot forming process of the soldering lug, the reflow peak temperature is not larger than 220 DEG C, and the low-temperature reflow requirement is met; since eutectic tin-bismuth soldering lugs are incompletely used in the soldering lug composition, bismuth supply can be reduced in the service process of a welding spot, a large amount of bismuth is prevented from gatheringon an interface, a continuous bismuth layer brittle phase is formed; and the resistane of the welding spot to thermal load and dynamic falling load is improved.

Description

technical field [0001] The invention relates to a composition of a low-temperature composite solder alloy solder sheet and a method for forming solder joints, and more specifically relates to a composite solder sheet used to replace low-temperature tin-bismuth solder sheets for welding, and is mainly used in the field of micro-connection. Background technique [0002] Recent studies have shown that the miniaturization of portable electronic products and the increase in packaging complexity have made flip chips thinner and thinner, and the packaging process requires multiple steps to complete. Most ultra-thin microprocessors using the standard SAC305 alloy cause severe dynamic warpage on the package substrate and PCB. Such defects can be mitigated and SMT yields improved when using low-temperature soldering processes with reflow below 200°C; moreover, lower reflow temperatures allow the use of cheaper substrates, significantly reducing energy, material, and operating costs. ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/18B23K35/40B23K1/00
CPCB23K35/262B23K35/0238B23K35/40B23K1/00
Inventor 彭巨擘蔡珊珊罗晓斌王加俊
Owner 云南锡业集团(控股)有限责任公司研发中心
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