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A contactless smart card production process and system

A non-contact, production system technology, applied in instruments, computing, record carriers used by machines, etc., can solve problems such as misalignment of the wire head and the chip, affecting the quality of chip welding, and virtual welding of the wire head and the chip. The effect of positioning and fixing, improving chip welding quality and improving positioning accuracy

Active Publication Date: 2021-09-07
GUANGZHOU ZHANFENG CARD MAKING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. When the rectangular coil is wound on the sheet material, the sheet material that has been wound needs to be manually transported to the placement platform, and then transported to the adhesive tape station for adhesive tape; then the winding will be completed The sheet material is transported to the chip welding station; in the process of sheet material handling and transfer, due to manual contact or mutual contact between the sheets during the moving process, it is easy for the wire ends of the coil on the sheet to be on the hole Offset, resulting in misalignment of the wire head and the chip during welding, resulting in false welding between the wire head and the chip, which affects the chip welding quality
[0005] 2. In the process of sticking the chip to the hole, the artificial method will cause the chip to shift, and it is difficult to ensure that the chip is located in the hole. Chip welding, which affects the quality of chip welding

Method used

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  • A contactless smart card production process and system
  • A contactless smart card production process and system
  • A contactless smart card production process and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] This embodiment discloses a non-contact smart card production system, including a punching module for punching sheet a, a coil winding module for winding a coil on sheet a, and a coil thread end The positioning and alignment module for positioning, the positioning module for positioning the chip 10 and the sheet material a, and the chip welding module for welding the chip 10 and the coil wire end.

[0056] see Figure 1-Figure 2 , the positioning and clapping module includes a mounting frame 1, a sheet material placement platform 2 arranged on the mounting frame 1 for placing the sheet material a, and a sheet material placing platform 2 arranged on the mounting frame 1 for placing the coil thread ends on the sheet material a A straightening mechanism 3 for shooting straight and a vertical driving mechanism 4 for driving the straightening mechanism 3 to move vertically.

[0057] see Figure 1-Figure 2 and Figure 11-Figure 12 , two first positioning pins 5 for positioni...

Embodiment 2

[0086] see Figure 15 , the other structures in this embodiment are the same as those in Embodiment 1, the difference is that the positive driving mechanism of the camera includes a driving motor 3-5, a gear 3-6 connected to the main shaft of the driving motor 3-5, and the The first rack 3-7 meshing below the gear 3-6 and the second rack 3-8 meshing above the gear 3-6, the first rack 3-7 is aligned with the first rack The plate 3-21 is fixedly connected, and the second rack 3-8 is connected to the second positive plate 3-22. Through the above-mentioned setting, it is also possible to realize the positive movement of the first positive plate 3-21 and the second positive plate 3-22.

Embodiment 3

[0088] Other structures in this embodiment are the same as those in Embodiment 1, the difference is that: the first positive drive mechanism 3-3, the second positive drive mechanism 3-4 and the vertical drive mechanism 4 can all use motors and The way of belt drive combination.

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Abstract

The invention discloses a production process and system of a non-contact smart card. The process comprises the following steps: firstly, punching a hole in a plate; winding a rectangular coil; The positive drive mechanism drives each pair of positive plates to make a positive movement close to each other, and when the coil wire ends are positively positioned to an accurate position; then the chip is placed on the chip storage slot of the chip positioning platform, and then the positively positioned plate is positioned The material is transported to the chip positioning platform; the chip positioning platform with the sheet and chip placed is transferred to the chip welding station as a whole, and the coil wire on the sheet is welded to the chip; finally the sheet is collected. This process not only performs positive positioning of the coil wire head on the sheet, but also precisely positions the chip; enables the coil wire head to achieve accurate alignment with the chip during the welding process of the chip, thereby improving the welding quality of the chip.

Description

technical field [0001] The invention relates to the technical field of smart card manufacturing, in particular to a non-contact smart card production process and system. Background technique [0002] A smart card is a plastic card with an embedded microchip, the chip being the heart of the smart card. Smart cards mainly include contact smart cards and contactless smart cards. With the development of contactless smart card technology, the requirements for the production and processing of smart cards are getting higher and higher. In the manufacturing process of the contactless smart card, the main processing procedures include laser drilling, winding, chip welding, ultrasonic composite welding and cutting. After the above processing steps, an independent smart card sheet unit is formed to provide semi-finished raw materials for other subsequent processing. [0003] The production of smart cards usually adopts semi-automatic production, and in semi-automatic production, fir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
CPCG06K19/07749
Inventor 余伟杰
Owner GUANGZHOU ZHANFENG CARD MAKING CO LTD
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