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Diode packaging process and packaged diode

A technology of packaging diodes and packaging technology, which is applied to electrical components, battery temperature control, circuits, etc., and can solve problems such as not being able to protect the internal structure of light-emitting diodes.

Active Publication Date: 2021-03-09
ZHONGSHAN JUMINGXING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present application provides a diode packaging process and a packaged diode, which can solve the problem that the internal structure of the light-emitting diode cannot be well protected by using the prior art packaging process to manufacture light-emitting diodes

Method used

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  • Diode packaging process and packaged diode
  • Diode packaging process and packaged diode
  • Diode packaging process and packaged diode

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Embodiment Construction

[0048] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0049] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude one or more other Presence or addition of features, wholes, steps, operations, elements, components and / or collections thereof.

[0050] It should...

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Abstract

The invention is suitable for the technical field of diode packaging, and provides a diode packaging process and a packaged diode, and the process comprises the steps: enabling a diode chip to be fixed on a metal substrate, and obtaining a to-be-packaged diode through manufacturing; placing a to-be-packaged diode in the central area in the tube shell, wherein the to-be-packaged diode is provided with a metal lead connected with an external pin; injecting silica gel into the tube shell to enable the silica gel to wrap the diode to be packaged and the metal lead; and injecting epoxy resin colloid into the tube shell by adopting a mould pressing packaging process to manufacture the packaged diode, generating an optical lens in the tube shell by the epoxy resin colloid, and fixing the opticallens in the central area of the upper surface layer of the silica gel. The to-be-packaged diode and the metal lead are wrapped by the silica gel, so that the structure of the metal lead in the packaged diode can be protected from being snapped even if the packaged diode is in a high-temperature working state.

Description

technical field [0001] The application belongs to the technical field of diode packaging, and in particular relates to a diode packaging process and a packaged diode. Background technique [0002] Traditional high-power light-emitting diode packaging technology uses epoxy resin as the packaging colloid to package the light-emitting diode chip in the mold. The light-emitting diodes will generate a lot of heat when they work, so that the thermal expansion and contraction of the metal wires connected to the external pins in the light-emitting diode chips are inconsistent with the thermal expansion and contraction of the epoxy resin, which will easily cause the metal wires to be pulled off and cause damage to the light-emitting diodes. By adding a curing material into the epoxy resin to cure the epoxy resin, the probability of the metal being broken can be reduced. However, adding curing materials into the epoxy resin will easily change the light conductivity of the epoxy resin...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/52H01L33/56H01L33/62H01L33/58H01M10/64
CPCH01L33/48H01L33/52H01L33/56H01L33/62H01L33/58H01L33/641Y02E60/10
Inventor 李志源郭小明
Owner ZHONGSHAN JUMINGXING ELECTRONICS
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