Insulation board machining device and method
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 济南建科德源新材料科技有限公司
- Publication Date
- 2021-03-12
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Abstract
Description
technical field
[0001] The application belongs to the technical field of thermal insulation board processing, and in particular relates to a thermal insulation board processing device and processing method. Background technique
[0002] The thermal insulation board is a product attached to the surface of the building and used for building insulation. The thermal insulation board has moisture-proof and waterproof properties, which can reduce the thickness of the building's outer enclosure structure, thereby increasing the indoor usable area.
[0003] The current thermal insulation boards are generally made of organic thermal insulation materials or inorganic thermal insulation materials. The inorganic thermal insulation materials are represented by cotton boards. The organic thermal insulation boards are represented by polyethylene foam boards and extruded polyethylene boards. The combustion performance index is poor, which is easy to cause fire incidents. Therefore, in order...