Semiconductor wafer surface cleaning device

Abstract

The invention relates to the technical field of mechanical equipment, in particular to a semiconductor wafer surface cleaning device which can conveniently improve the cleanliness of the surface of awafer, improve the cleaning effect, reduce impurity residues, save the physical strength and time during manual cleaning, improve the working efficiency and improve practicability and reliability by automatically cleaning the wafer. The semiconductor wafer surface cleaning device comprises a base, a workbench, a U-shaped frame, four sets of supporting legs, two sets of tugs and two sets of supporting groove plates, wherein a water supply device is arranged on the right side of the base, the workbench is installed on the base, a feeding device is transversely arranged at the top of the workbench, the U-shaped frame is located above the workbench and fixed to the outer side of the top of the workbench through the four sets of supporting legs, and the two sets of tugs are rotationally installed on the left side of the front portion and the left side of the rear portion of the U-shaped frame respectively.

Description

technical field [0001] The invention relates to the technical field of mechanical equipment, in particular to a semiconductor wafer surface cleaning device. Background technique [0002] As we all know, a semiconductor wafer is mainly an electronic auxiliary component composed of silicon, which is usually a thin sheet. When the wafer is processed and produced for electronic components, it is necessary to clean up the impurities attached or remaining on the wafer surface, so as to ensure The cleanliness of the wafer surface prevents impurities from polluting and damaging the electronic components. The existing cleaning method is mainly for workers to clean the surface of the wafer with a brush. The cleaning method is relatively old and requires more manpower and time. At the same time, after manual cleaning Impurities tend to remain on the surface of the wafer, resulting in poor cleaning effect. Contents of the invention [0003] In order to solve the above-mentioned techn...

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Problems solved by technology

[0002] As we all know, a semiconductor wafer is mainly an electronic auxiliary component composed of silicon, which is usually a thin sheet. When the wafer is processed and produced with electronic components, it is necessary to clean up the impurities attached or remaining on the surface of the wafer, so as to ensure The cleanliness of the wafer surface prevents impurities from polluting and damaging the electronic components. The existing cleaning method is mainly for workers to clean the surface of the wafer with a brush. The cleaning method is relatively old and requires a lot of manpower and time. At the same time, after manual cleaning Impurities are easy to remain on the surface of the wafer, resulting in poor cleaning effect

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