Etching method of seed layer, wafer level packaging bonding ring and manufacturing method of wafer level packaging bonding ring

Abstract

The invention relates to an etching method of a seed layer, which is used in wafer-level packaging. The method comprises the following steps: S1, carrying out mask operation on a wafer with a seed layer and an MEMS cavity, and only exposing a bonding ring during operation; S2, after the mask operation is completed, carrying out the electroplating operation on the seed layer at the bonding ring; S3, after the electroplating operation is completed, removing the mask to expose the seed layer; S4, after the mask is removed, etching to remove the seed layer by adopting a mixture of ammonia water, hydrogen peroxide and water, so that the bonding ring is metalized. The invention further provides a manufacturing method of the wafer-level packaging bonding ring, and the etching method of the seed layer is adopted to obtain the wafer-level packaging bonding ring. The invention further provides a wafer-level packaging bonding ring which is manufactured by adopting the manufacturing method. By exploring a new etching method, one-time etching of the seed layer is realized, the process time is greatly shortened, the product stability is enhanced, the enterprise cost can be remarkably reduced, and the limitation of foreign countries on key materials is broken.

Description

technical field [0001] The invention relates to the technical field of MEMS wafer-level packaging, in particular to an etching method for a seed layer, a wafer-level packaging bonding ring and a manufacturing method thereof. Background technique [0002] MEMS is the abbreviation of micro electromechanical system (microelectromechanical system). A MEMS usually contains some fine structures with extremely small sizes. Before these structures are assembled into related products, if they are not well packaged, they are easily disturbed by the external environment, affecting their performance, and even causing structural damage. Generally speaking, there are two main types of MEMS packages: metal package and ceramic package. Regardless of metal packaging or ceramic packaging, it is necessary to cut the wafer into hundreds of individual chips, and then perform operations such as patching and wiring, and finally complete chip-level packaging. Because the packaging process is com...

AI Technical Summary

Problems solved by technology

The above process is carried out in two steps and expensive imported materials are used, which makes the process time of this scheme long, the production cost is high, and it is easy to produce lateral erosion

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