Sapphire wafer positioning and tracking method based on circle detection

Abstract

The invention discloses a sapphire wafer positioning and tracking method based on circle detection. The sapphire wafer positioning and tracking method sequentially comprises the following steps of: (1) collecting a single calibration plate image and the position information of a corresponding robot tail end clamp for calibration, so as to obtain a relation matrix between a camera coordinate systemand a robot coordinate system; (2) collecting a single ceramic disc image and processing the single ceramic disc image by means of a visual detection system, and detecting all sapphire wafers and ceramic discs; (3) calculating to obtain the number, positions and angle information of the sapphire wafers by means of the visual detection system; and (4) acquiring position information of the sapphirewafer under a robot coordinate system through coordinate transformation, realizing positioning of the sapphire wafer by the robot, and then performing accurate thickness measurement. The sapphire wafer positioning and tracking method combines visual positioning and automatic measurement, achieves automatic detection of the thickness of the sapphire wafer, and has high flexibility.

Description

Technical field[0001]The present invention belongs to the field of visual positioning, and is specifically involved in a circularly detected sapphire wafer positioning tracking method.Background technique[0002]The existing sapphire wafer thickness detection is performed by manual, using the sensor to measure the thickness of each sapphire wafer on the ceramic disc, and then manually record data in the table, and the efficiency is low, and it is easy to statistically errors. In this context, it is proposed to achieve positioning detection by means of automation and visual positioning technology, thereby increasing the degree of automation of the factory, reducing labor costs and labor intensity. The main functions of the visual inspection system include: 1, identify the two-dimensional code on the back of the ceramic disc, for the positioning angle, perform sapphire wafer sorting; 2. Detect the sapphire wafer position on each model ceramic disk, and send it to the robot to position. ...

AI Technical Summary

Problems solved by technology

[0002] Existing sapphire wafer thickness detection is done manually, using sensors to measure the thickness of each sapphire wafer on the ceramic plate, and then manually recording the data in the form, which is inefficient and prone to statistical errors

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