A lead frame copper strip batch leveling and slicing device

Abstract

A lead frame copper strip batch leveling and slicing device includes a leveling unit, a slicing unit, and a turning collection unit. The leveling unit is used for leveling the copper strip of the lead frame. The leveling unit includes a first guiding mechanism and a flattening mechanism; The tape machine, the second guide mechanism, the tape cutting machine includes a control box, and the control box is equipped with a cutter; the steering collection unit is located at one end of the slicing unit, which is used to change the transportation direction of the copper sheet of the lead frame to be transported along its width direction, and turn to the collection unit Including transfer mechanism, alignment mechanism, translation mechanism, transmission mechanism. The present invention can perform multiple simultaneous batch operations on various lead frame copper strips within a certain width range, and perform a leveling operation before the slicing step to improve the uniformity and flatness of the slicing, and after slicing, the copper strips can be cut along the width Conveying in the opposite direction saves energy consumption for conveying.

Description

technical field [0001] The invention relates to lead frame production, in particular to a batch leveling and slicing device for lead frame copper strips. Background technique [0002] As the chip carrier of integrated circuits, the semiconductor lead frame is a key structural component that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] There are two common production schemes for lead frames: etching and stamping, among which stamping has the advantage of low production cost. Existing stamping processing technology is to use copper strip as raw material, after blanking with a slicer, it is stamped by a punching machine, leveled and then surface treated. ...

AI Technical Summary

Problems solved by technology

[0004] However, if the leveling is carried out after slicing and stamping, the quality of the copper sheet cannot be guaranteed before stamping, mainly because the copper strip is not completely flat before slicing, and the slicer will make the thickness of each copper sheet The length is not uniform, or the cut surface is not flat, so a device is needed to make the copper strip pass through the slicing equipment before slicing

[0005] In the existing stamping process, there is still the disadvantage of low output efficiency of copper sheets. The production line can only slice the single-pass copper strip, and the speed is relatively slow.

And a single production line can only slice copper strips of the same width, which has great limitations

[0006] In addition, after the copper strip is cut into copper sheets, when the copper sheets are transported to the production line of the next process along its length, each copper sheet needs to be transported with a long path, which consumes more energy for conveying the copper sheet material

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