Batch leveling and slicing device for lead frame copper strips

A lead frame and slicing device technology, which is applied in the field of lead frame copper strip batch leveling and slicing devices, can solve the problems of large limitations, uneven cutting surface, slow speed, etc., to improve the leveling quality, prevent left and right shaking, and prevent stacking Effect
CN112496764AActive Publication Date: 2021-03-16四川富美达微电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
四川富美达微电子有限公司
Publication Date
2021-03-16

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Abstract

The invention discloses a batch leveling and slicing device for lead frame copper strips. The batch leveling and slicing device comprises a leveling unit, a slicing unit and a steering collection unit, the leveling unit is used for leveling the lead frame copper strips and comprises a first guide mechanism and a leveling mechanism, the slicing unit is arranged at one end of the leveling unit, is used for cutting the lead frame copper strips into copper sheets and comprises a strip cutting machine and a second guide mechanism, the strip cutting machine comprises a control box, the control box is provided with a cutter, and the steering collection unit is arranged at one end of the slicing unit, is used for converting the conveying direction of the lead frame copper sheets into the width direction of the lead frame copper sheets and comprises a transferring mechanism, an arranging mechanism, a horizontal moving mechanism and a conveying mechanism. According to the batch leveling and slicing device, simultaneous batch operation can be carried out on the multiple various lead frame copper strips within a certain width range, in addition, leveling operation is carried out before the slicing step, so that the slicing uniformity and flatness are improved, the copper sheets can be conveyed in the width direction after slicing, and the energy consumption used for conveying is saved.
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Description

technical field

[0001] The invention relates to lead frame production, in particular to a batch leveling and slicing device for lead frame copper strips. Background technique

[0002] As the chip carrier of the integrated circuit, the semiconductor lead frame is a key structural component that realizes the electrical connection between the terminal of the internal circuit of the chip and the outer leads by means of bonding materials, and forms an electrical circuit. Most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry.

[0003] There are two common manufacturing schemes for lead frames: etching processing and stamping processing. Among them, stamping processing has the advantage of low production cost. The existing stamping process takes copper strip as raw material, which is cut by a slicer and then punched by a punching machine, flattened and then surface treated.

[0004] However, if it ...

Claims

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