Batch leveling and slicing device for lead frame copper strips

A lead frame and slicing device technology, which is applied in the field of lead frame copper strip batch leveling and slicing devices, can solve the problems of large limitations, uneven cutting surface, slow speed, etc., to improve the leveling quality, prevent left and right shaking, and prevent stacking Effect

Active Publication Date: 2021-03-16
四川富美达微电子有限公司
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if the leveling is carried out after slicing and stamping, the quality of the copper sheet cannot be guaranteed before stamping, mainly because the copper strip is not completely flat before slicing, and the slicer will make the thickness of each copper sheet The length is not uniform, or the cut surface is not flat, so a device is needed to make the copper strip pass through the slicing equipment before slicing
[0005] In the existing stamping process, there is still the disadvantage of low output efficiency of copper sheets. The production line can only slice the single-pass copper strip, and the speed is relatively slow.
And a single production line can only slice copper strips of the same width, which has great limitations
[0006] In addition, after the copper strip is cut into copper sheets, when the copper sheets are transported to the production line of the next process along its length, each copper sheet needs to be transported with a long path, which consumes more energy for conveying the copper sheet material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Batch leveling and slicing device for lead frame copper strips
  • Batch leveling and slicing device for lead frame copper strips
  • Batch leveling and slicing device for lead frame copper strips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] like Figure 1-Figure 17 The shown device for batch leveling and slicing of lead frame copper strips includes a leveling unit 1 and a slicing unit 2 .

[0058] The leveling unit 1 is used for leveling the lead frame copper tape. The leveling unit 1 includes a first guide mechanism 11 and a flattening mechanism 12. The first guide mechanism 11 includes a guide table 111. The upper end surface of the guide table 111 is provided with a plurality of first guide mechanisms. A guide groove 1111, one end of the guide table 111 is provided with a first bracket 1121 at a predetermined distance. A lateral plate 1122 is provided with a plurality of first branch rods 1123 on one side, one end of the first branch rod 1123 is provided with a first guide plate 113 at the lower end of the outer circumference side, and a plurality of first guide grooves 1111 are arranged on the bottom end of the first guide plate 113 in an array. The first guide strip 1131 is used to limit the copper s...

Embodiment 2

[0064] like Figure 1-Figure 27 The shown device for batch leveling and slicing of lead frame copper strips includes the batch leveling and slicing device for lead frame copper strips of the first embodiment, and a steering collection unit 3 .

[0065] The turning and collecting unit 3 is set at one end of the slicing unit 2. The turning and collecting unit 3 includes a transfer mechanism 31, an arrangement mechanism 32, a translation mechanism 33, and a transfer mechanism 34. The transfer mechanism 31 includes a plurality of fifth brackets 3111 arranged in an array, and the fifth brackets 3111 The upper end is provided with a slideway 311 for sliding the copper sheet. The slideway 311 is a ramp whose height decreases from the feed end to the feed end. The feed end of the slideway 311 is set at the feed end of the second guide groove 2151, and the feed end of the slideway 311 is vertical. The arrangement is arranged in a straight array. The arrangement mechanism 32 is arranged...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a batch leveling and slicing device for lead frame copper strips. The batch leveling and slicing device comprises a leveling unit, a slicing unit and a steering collection unit, the leveling unit is used for leveling the lead frame copper strips and comprises a first guide mechanism and a leveling mechanism, the slicing unit is arranged at one end of the leveling unit, is used for cutting the lead frame copper strips into copper sheets and comprises a strip cutting machine and a second guide mechanism, the strip cutting machine comprises a control box, the control box is provided with a cutter, and the steering collection unit is arranged at one end of the slicing unit, is used for converting the conveying direction of the lead frame copper sheets into the width direction of the lead frame copper sheets and comprises a transferring mechanism, an arranging mechanism, a horizontal moving mechanism and a conveying mechanism. According to the batch leveling and slicing device, simultaneous batch operation can be carried out on the multiple various lead frame copper strips within a certain width range, in addition, leveling operation is carried out before the slicing step, so that the slicing uniformity and flatness are improved, the copper sheets can be conveyed in the width direction after slicing, and the energy consumption used for conveying is saved.

Description

technical field [0001] The invention relates to lead frame production, in particular to a batch leveling and slicing device for lead frame copper strips. Background technique [0002] As the chip carrier of the integrated circuit, the semiconductor lead frame is a key structural component that realizes the electrical connection between the terminal of the internal circuit of the chip and the outer leads by means of bonding materials, and forms an electrical circuit. Most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] There are two common manufacturing schemes for lead frames: etching processing and stamping processing. Among them, stamping processing has the advantage of low production cost. The existing stamping process takes copper strip as raw material, which is cut by a slicer and then punched by a punching machine, flattened and then surface treated. [0004] However, if it ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B23P23/04B21D1/02B21D43/22B21D43/28B23D15/08
CPCB21D1/02B21D43/22B21D43/287B23D15/08B23P23/04
Inventor 曾尚文陈久元杨利明刘高宸
Owner 四川富美达微电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap