A method for optimizing the magnetic properties of cobalt-based magnetic thin film inductor materials
A technology of magnetic film and magnetic properties, applied in the application of magnetic film to substrate, inductance/transformer/magnet manufacturing, circuits, etc., can solve the problems of thick magnetic layer, many periodicities, and limiting the ability to control the magnetic properties of thin films. , to achieve the effect of low cost, convenient control and high efficiency
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Embodiment 1
[0029] S1. Clean the surface of the CoZrTa target, and the specific cleaning process is as follows:
[0030] (1) ultrasonic cleaning with acetone alcohol first;
[0031] (2) ultrasonic cleaning with deionized water;
[0032] (3) Finally blow dry by nitrogen.
[0033] S2. Using the magnetron sputtering method, deposit CoZrTa and Al on the silicon substrate in turn 2 O 3 , forming CoZrTa / Al 2 O 3 Structure; first CoZrTa target bombardment for 2 minutes and 50 seconds, then Al 2 O 3 The target was bombarded for 7 minutes and 48 seconds, and the background vacuum of the sputtering chamber was 1×10 -5 Pa, the argon pressure during sputtering is 0.3Pa;
[0034] S3. After the deposition is completed, the sample is subjected to vacuum heat treatment, and the process is: the vacuum degree is 1×10 -5 Pa, the heat treatment temperature was 250°C, and the holding time was 30 minutes.
Embodiment 2
[0036] S1. Clean the surface of the CoZrTa target, and the specific cleaning process is as follows:
[0037] (1) ultrasonic cleaning with acetone alcohol first;
[0038] (2) ultrasonic cleaning with deionized water;
[0039] (3) Finally blow dry by nitrogen.
[0040] S2. Using the magnetron sputtering method, deposit CoZrTa and Al on the silicon substrate in turn 2 O 3 , forming CoZrTa / Al 2 O 3 Structure; first CoZrTa target bombardment for 2 minutes and 50 seconds, then Al 2 O 3 The target was bombarded for 7 minutes and 48 seconds, and the background vacuum of the sputtering chamber was 1×10 -5 Pa, the argon pressure during sputtering is 0.3Pa;
[0041] S3. After the deposition is completed, the sample is subjected to vacuum heat treatment, and the process is: the vacuum degree is 1×10 -5 Pa, the heat treatment temperature was 350°C, and the holding time was 30 minutes.
Embodiment 3
[0043] S1. Clean the surface of the CoZrTa target, and the specific cleaning process is as follows:
[0044] (1) ultrasonic cleaning with acetone alcohol first;
[0045] (2) ultrasonic cleaning with deionized water;
[0046] (3) Finally blow dry by nitrogen.
[0047] S2. Using the magnetron sputtering method, deposit CoZrTa and Al on the silicon substrate in turn 2 O 3 , forming CoZrTa / Al 2 O 3 Structure; first CoZrTa target bombardment for 2 minutes and 50 seconds, then Al 2 O 3 The target was bombarded for 7 minutes and 48 seconds, and the background vacuum of the sputtering chamber was 1×10 -5 Pa, the argon pressure during sputtering is 0.3Pa;
[0048] S3. After the deposition is completed, the sample is subjected to vacuum heat treatment, and the process is: the vacuum degree is 1×10 -5 Pa, the heat treatment temperature was 450°C, and the holding time was 30 minutes.
[0049] figure 1 For the magnetic properties of the sample, the thickness of the interface mag...
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