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Polishing machine capable of automatically replacing polishing disc

A technology for automatic replacement and polishing of discs, applied in the field of polishing machines, can solve problems such as affecting polishing efficiency and reducing work efficiency, and achieve the effects of improving polishing efficiency, good cooling, and accurate polishing surfaces

Active Publication Date: 2021-03-19
连城凯克斯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When polishing a wafer or crystal rod, the crystal is generally polished by a polishing machine. During the polishing process, it is necessary to replace the polishing sheet with different polishing degrees. Affect polishing efficiency and reduce work efficiency

Method used

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  • Polishing machine capable of automatically replacing polishing disc
  • Polishing machine capable of automatically replacing polishing disc
  • Polishing machine capable of automatically replacing polishing disc

Examples

Experimental program
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Effect test

Embodiment approach

[0030] As an embodiment of the present invention, the trickle structure 8 includes a support plate 81, a fixed plate 82, a liquid storage tank 83, a diversion bag 84, a valve 85, a sliding buckle 86, a guide rail 87, a limit rod 88, a protective Cover 89, nozzle 810 and contraction spring 811, the bottom side of the support plate 81 is arranged with a guide rail 87, the guide rail 87 is equipped with a slide button 86, and the fixed plate 82 is welded on one end of the guide rail 87, The limiting rod 88 is welded on one side of the fixing plate 82, and one end of the limiting rod 88 is installed inside the sliding buckle 86, and the protective cover 89 is welded on the bottom side of the sliding buckle 86. The nozzles 810 are arranged on the top side of the inner wall of the protective cover 89, the liquid storage tank 83 is fixed on the top side of the support plate 81, the fluid storage tank 83 and the nozzles 810 are connected by a conduit, and a diversion bag is connected i...

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PUM

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Abstract

The invention discloses a polishing machine capable of automatically replacing a polishing disc. The polishing machine comprises a support, a fixed frame, an air cylinder, a polishing motor, a slidingblock, a sliding rail, a replacing structure, a dripping structure and a positioning clamping structure; the sliding rail is arranged on the top side of the support; the polishing motor is mounted onthe top side of the sliding block in a matched mode; the fixed frame is welded to the end of the sliding rail; the air cylinder is mounted on the fixed frame through bolts in a matched mode; the endof an actuating rod of the air cylinder is welded to the polishing motor; the replacing structure is mounted on a rotating shaft of the polishing motor in a matched mode; and a swing motor operates todrive a swing gear to rotate, a matching shaft can be driven to rotate in a matched mode under matching of a matching gear, and a mounting frame is rotated in a matched mode. According to the polishing device, a plurality of polishing pieces can be replaced in a matched mode, after replacement, the polishing motor drives the mounting frame to rotate, polishing and grinding of crystals are achieved, the polishing pieces can be replaced cyclically and periodically, the polishing efficiency can be greatly improved, and the accuracy of a polished surface can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a polishing machine capable of automatically replacing a polishing disk. Background technique [0002] Semiconductor materials are the cornerstone of the modern semiconductor industry and microelectronics industry. From a physical point of view, it refers to a class of materials whose conductivity is between conductors and insulators. [0003] There are many kinds of semiconductor materials, which can be roughly divided into three types: inorganic semiconductor crystals, organic semiconductor materials and amorphous semiconductors. At present, amorphous semiconductor materials have great application prospects in solar cells. But overall, inorganic semiconductor crystals still dominate semiconductor materials; [0004] When polishing a wafer or crystal rod, the crystal is generally polished by a polishing machine. During the polishing process, it is necessary to replace ...

Claims

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Application Information

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IPC IPC(8): B24B29/04B24B27/00B24B41/04B24B47/22B24B57/02B24B55/02
CPCB24B29/04B24B27/0076B24B41/04B24B47/22B24B57/02B24B55/02
Inventor 李方许星杰王明升李秉东辛珊
Owner 连城凯克斯科技有限公司
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