High-thermal-conductivity wave-absorbing shielding gasket and production process thereof

Abstract

The invention relates to the technical field of heat conduction and wave absorption, in particular to a high-thermal-conductivity and wave-absorbing shielding gasket and a production process thereof.The high-thermal-conductivity and wave-absorbing shielding gasket comprises a heat-conducting wave-absorbing base material, a release film and a metal layer, the heat-conducting wave-absorbing base material covers the outer surface of the metal layer, the release film covers the outer surface of the heat-conducting wave-absorbing base material, and the heat-conducting wave-absorbing base materialis prepared from heat-conducting powder and magnetic powder. The high-thermal-conductivity wave-absorbing shielding gasket disclosed by the invention not only has excellent thermal conductivity and wave-absorbing performance, but also has good operability and an electromagnetic shielding function, can be widely applied to shielding electromagnetic noise generated by a CPU, an FPC, a digital camera, a microphone, an RAM, an antenna, a component and the like, and can also play a role in heat conduction; and meanwhile, the metal layer in the middle of the product can also realize the omnibearingheat conduction and electromagnetic shielding effects of the material.

Description

technical field [0001] The invention relates to the technical field of heat conduction and wave absorption, in particular to a high heat conduction wave absorbing shielding gasket and a production process thereof. Background technique [0002] With the development of the times, the continuous improvement of people's living standards and the transformation of consumption and entertainment methods have led to rapid changes in electronic products and a huge market demand; the increasingly powerful functional requirements and the development trend of miniaturization of electronic devices have caused the function of products With the continuous improvement of power consumption, the problems of heat dissipation and electromagnetic wave interference have become more and more prominent, which has restricted the rapid development of the industry; traditional heat dissipation and electromagnetic wave interference solutions are generally realized by combining heat-conducting materials a...

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Problems solved by technology

[0002] With the development of the times, the continuous improvement of people's living standards, and the transformation of consumption and entertainment methods have led to rapid changes in electronic products, and the market demand is very huge; the increasingly powerful functional requirements and the development trend of miniaturization of electronic devices have caused the function With the continuous improvement of power consumption, the problems of heat dissipation and electromagnetic wave interference have become increasingly prominent, which has restricted the rapid development of the industry; traditional heat dissipation and electromagnetic wave In electronic products with narrow space, the problem is more obvious, such as high thermal conductivity gasket, based on high thermal conductivity and poor structure, it is difficult to operate if the thickness is less than 0.3mm, and it will be broken when pinched; traditional technology can add glass fiber cloth for support Function, to enhance the operability of the material, but the thermal resistance of the glass fiber cloth is relatively large, the oil absorption capacity is strong, and the thermal conductivity drops significantly.

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