Modular multi-level sub-module, valve tower and AC withstand voltage test method

Abstract

The disclosure relates to a modular multilevel sub-module, a valve tower and an AC withstand voltage testing method. Modular multi-level sub-module, including: DC capacitor, power semiconductor unit, energy harvesting power supply, main control circuit and supporting metal structure; DC capacitor includes DC capacitor positive pole, DC capacitor negative pole, connected in parallel with power semiconductor unit; energy harvesting power supply from DC capacitor energy harvesting; the power semiconductor unit includes power semiconductor devices, heat sinks and AC output ports; the energy harvesting power supply includes a metal case for the power supply, and the main control circuit includes a metal case for the circuit; the negative pole of the DC capacitor serves as an equipotential point; One or more of the casing, the heat sink and the supporting metal structure form an equipotential bonding surface, and the equipotential bonding surface is electrically connected to the equipotential points. The disclosure improves the anti-interference ability of the modular multi-level sub-module through the equipotential connection of metal parts in the modular multi-level sub-module.

Description

technical field

[0001] The disclosure belongs to the technical field of high-power electric power electronic conversion, and in particular relates to a modular multi-level sub-module, a valve tower and an AC withstand voltage testing method. Background technique

[0002] Equipotential bonding originates from the grounding method of the three-phase AC power distribution system. In the design of building electricity, the impedance between metal parts should be reduced as much as possible by means of equipotential connection, and the potential difference between each metal part should be eliminated to ensure personal safety and safety of electrical equipment. For example, in the three-phase four-wire AC power distribution system, use the "TN-C" grounding method to connect all exposed conductive parts and external conductive parts to the neutral line to achieve the purpose of equipotential connection and ensure Personal safety and equipment safety. At the same time, equipotent...

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