Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Modular multi-level sub-module, valve tower and AC withstand voltage test method

A modular multi-level, sub-module technology, applied in the direction of testing dielectric strength, converting AC power input to DC power output, measuring electricity, etc., can solve problems such as equipotential connection, achieve balanced potential distribution, and improve anti-interference Ability, effect of eliminating connection points

Active Publication Date: 2022-03-29
NR ELECTRIC CO LTD +1
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sub-modules are connected in series to form a valve tower, which also has the problem of equipotential connection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Modular multi-level sub-module, valve tower and AC withstand voltage test method
  • Modular multi-level sub-module, valve tower and AC withstand voltage test method
  • Modular multi-level sub-module, valve tower and AC withstand voltage test method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

[0041] In describing the present disclosure, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Straight", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", etc. or The positional relationship is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the referred device or element must have a specific ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The disclosure relates to a modular multilevel sub-module, a valve tower and an AC withstand voltage testing method. Modular multi-level sub-module, including: DC capacitor, power semiconductor unit, energy harvesting power supply, main control circuit and supporting metal structure; DC capacitor includes DC capacitor positive pole, DC capacitor negative pole, connected in parallel with power semiconductor unit; energy harvesting power supply from DC capacitor energy harvesting; the power semiconductor unit includes power semiconductor devices, heat sinks and AC output ports; the energy harvesting power supply includes a metal case for the power supply, and the main control circuit includes a metal case for the circuit; the negative pole of the DC capacitor serves as an equipotential point; One or more of the casing, the heat sink and the supporting metal structure form an equipotential bonding surface, and the equipotential bonding surface is electrically connected to the equipotential points. The disclosure improves the anti-interference ability of the modular multi-level sub-module through the equipotential connection of metal parts in the modular multi-level sub-module.

Description

technical field [0001] The disclosure belongs to the technical field of high-power electric power electronic conversion, and in particular relates to a modular multi-level sub-module, a valve tower and an AC withstand voltage testing method. Background technique [0002] Equipotential bonding originates from the grounding method of the three-phase AC power distribution system. In the design of building electricity, the impedance between metal parts should be reduced as much as possible by means of equipotential connection, and the potential difference between each metal part should be eliminated to ensure personal safety and safety of electrical equipment. For example, in the three-phase four-wire AC power distribution system, use the "TN-C" grounding method to connect all exposed conductive parts and external conductive parts to the neutral line to achieve the purpose of equipotential connection and ensure Personal safety and equipment safety. At the same time, equipotent...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H02M7/00H02M7/483G01R31/12
CPCH02M7/003H02M7/483G01R31/129
Inventor 谢晔源王宇曹冬明姜田贵高彪
Owner NR ELECTRIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com