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43results about How to "Uniform potential distribution" patented technology

Low-resistance device with equipotential floating grooves and manufacturing method of low-resistance device

The invention provides a low-resistance device with equipotential floating grooves, and the device comprises a first conductive type semiconductor substrate, a first conductive type well region, a first conductive type source end heavily doped region, a second conductive type drift region, a second conductive type well region, a second conductive type source end heavily doped region and a second conductive type drain end heavily doped region, a first dielectric oxide layer, a second dielectric oxide layer, a third dielectric oxide layer, a floating field plate polycrystalline silicon electrode, a control gate polycrystalline silicon electrode, source metal, drain metal and a metal strip; the first dielectric oxide layer and the floating field plate polycrystalline silicon electrode form alongitudinal floating field plate which is distributed in the whole second conductive type drift region; under the same length, the dielectric layer can bear higher breakdown voltage, the floating electrode can modulate the potential distribution of the drift region, so the potential distribution is uniform, the withstand voltage of the device is further improved, the floating field plate assistsin depletion, and the injection dose of the drift region can also be improved, so that the specific on-resistance is reduced.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA +1

Strengthening control method of photoelectro-Fenton pretreatment of tea polyphenol pharmaceutical wastewater

The invention discloses a strengthening control method of photoelectro-Fenton pretreatment of tea polyphenol pharmaceutical wastewater. The strengthening control comprises the following steps: (1) firstly introducing tea polyphenol pharmaceutical wastewater into an adjusting tank, adding Ca(OH)2 to adjust the pH value of the wastewater to 2.5-4, and adding Na2SO4 as an electrolyte of a subsequentphotoelectro-Fenton reaction so as to improve the electrical conductivity of the tea polyphenol pharmaceutical wastewater solution; and (2) introducing the adjusted effluent to a photoelectro-Fenton oxidation reaction tank. According to the strengthening control method provided by the invention, a three-electrode reaction and ultraviolet lamp irradiation are adopted; a H2O2 water solution is automatically generated by an electrochemical method in a certain amount of the sodium sulfate electrolyte; and no additional Fe is needed, the inconvenience caused by the addition of H2O2 is avoided, andthe use cost of additional reagents is reduced. Compared with a conventional Fenton reaction, the method provided by the invention has the additional ultraviolet lamp irradiation, and oxygen in the solution can be promoted to generate H2O2, so that more .OH is generated, and the degradation of organic matter in the wastewater solution is improved.
Owner:ZHEJIANG UNIV OF TECH

Junction field effect transistor and preparation method thereof

The present invention discloses a junction field effect transistor which comprises a P type substrate, a P type buried layer, N type buried layers arranged at two sides of the P type buried layer, an N type epitaxial layer, a first isolation structure, a second isolation structure, a third isolation structure and a fourth isolation structure which are arranged on the N type epitaxial layer, a source electrode area arranged between the first isolation structure and the second isolation structure, a first N well area arranged under the source electrode area, a gate electrode area arranged between the second isolation structure and the third isolation structure, a drain electrode area arranged between the third isolation structure and the fourth isolation structure, a second well area arranged under the source electrode area, and at least one P type field limit ring which is arranged above the N type epitaxial layer and is between the source electrode area and the drain electrode area. According to the above junction field effect transistor, the effect of Triple RESURF can be realized, the pinch-off voltage can be reduced effectively, and the purpose of low pinch-off voltage is realized. The invention also discloses the preparation method of the junction field effect transistor.
Owner:CSMC TECH FAB2 CO LTD

Enhanced high electron mobility transistor and manufacturing method thereof

The invention discloses an enhanced high electron mobility transistor and a manufacturing method thereof. The objective of the invention is to solve the problems that an existing power switch device is low in threshold voltage and complex in process when high breakdown voltage is achieved. The transistor comprises a substrate (1), a transition layer (2), a barrier layer (3), a gate groove (4), a drain groove (5), a P-type layer (6), a P-type drain column (7), a gate column (9), a source (11), a table top (14), a grid electrode (15) and a passivation layer (16) N-type row columns (8) are arranged in the grid columns; array holes (10) are formed in the barrier layer on the left side of the gate column and the barrier layer on the right side of the P-type drain column; an ohmic contact (12) is arranged on the right side of the P-type drain column, and the P-type drain column and the ohmic contact jointly form a drain electrode (13); a composite plate (17) is arranged at the upper part ofthe passivation layer; and a protective layer (18) is arranged on the peripheries of the passivation layer and the composite board. The transistor is simple in process, good in forward blocking and reverse blocking and high in threshold voltage, and can be used as a switching device.
Owner:XIDIAN UNIV

Power-junction-type field effect transistor and manufacturing method thereof

The invention relates to a power-junction-type field effect transistor comprising a P-type substrate, a buried layer region which is arranged on the substrate, a well region which is arranged on the buried layer region, an N-type source electrode and a drain electrode, a P-type gate electrode and a junction region. The source electrode, the drain electrode, the gate electrode and the junction region are arranged in the well region. The buried layer region comprises an N-type buried layer and a P-type buried layer which is arranged at the external side of the N-type buried layer. The well region comprises an N-well which is arranged on the N-type buried layer and a P-well which is arranged on the P-type buried layer and positioned at the external side of the N-type buried layer. The junction region is provided with multiple strip-shaped structures which are arranged in a spacing way and separated by the N-well. The drain electrode is arranged in the N-well and positioned at the internal side of the strip-shaped structure of the innermost side. The source electrode is arranged in the N-well and positioned at the external side of the strip-shaped structure of the outermost side. The part, which is arranged exactly above the P-type buried layer, of the N-well and the P-well are interdigital-arranged in a staggered way. The invention also relates to a circular power-junction-type field effect transistor and a manufacturing method of the power-junction-type field effect transistor. Low pinch-off voltage can be ensured and high current driving capability and high voltage withstanding can be acquired simultaneously.
Owner:CSMC TECH FAB2 CO LTD

Method and device for obtaining high-voltage electricity surface unipolar discharging trace

ActiveCN108638726AAvoid self-healing phenomenonReduce weightSpecial ornamental structuresTransformerOperability
The invention provides a method and device for obtaining a high-voltage electricity surface unipolar discharging trace. Through cooperation of a conductive additive, the unipolar discharging trace canbe obtained on the surface of a product through pulse direct current. In the method and the device, a PWM signal generator generates a drive signal, a direct-current pulse voltage is obtained by stimulating a boosting transformer and a rectifying circuit through a power amplifier, the voltage is transmitted to a positive electrode and a negative electrode, the positive electrode and the negativeelectrode are then placed on the product where the conductive additive permeates the surface layer, surface discharging is conducted from an anode or a cathode, and the unipolar discharging trace is left on the surface layer of the product. The macroscopic pattern of the discharging trace has fractal features and can be used for artistic creation, fractal picture template manufacture and craft manufacture. Compared with a method and device for obtaining a discharging trace by applying the industry alternating-current high voltage on the surface of a wet material, the method has the beneficialeffects that unipolar control is achieved, operability is high and pattern continuity is ensured; and the device has the beneficial effects that the device is easy to obtain and the structure is simple.
Owner:BEIJING UNIV OF TECH

Plasma processing equipment and lower electrode mechanism of the equipment

The invention discloses a lower electrode mechanism of plasma processing equipment. The lower electrode mechanism comprises a lower electrode base plate, an ground pole supporting member, a ground pole, a support plate supporting member, a support plate, and a heater, and the lower electrode base plate is grounded. The ground pole supporting member is arranged above the lower electrode base plate, and is capable of being vertically lifted up and down. The upper end of the ground pole is connected to the support plate supporting member, and the lower end of the ground pole is connected to the ground pole supporting member. The support plate supporting member is arranged above the ground pole supporting member, is grounded, and is electrically insulated from the ground pole. The support plate is supported by the support plate supporting member, and is directly grounded through the support plate supporting plate. The heater is arranged between the support plate supporting member and the ground pole supporting member. The lower electrode mechanism has the advantages of simple ground current route and high repeatability, and solves the problem of imperfect earth of lower electrode. The invention also discloses plasma processing equipment comprising the lower electrode mechanism.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Ultra-high voltage porcelain bushing type zero-clearance zinc oxide lightning arrester

The invention provides an ultra-high voltage porcelain bushing type zero-clearance zinc oxide lightning arrester. The problem to be solved by the invention is that the lightning arrester used at present is formed by connecting four and less than four lightning arrester elements in series to be fixed on a base; and due to the limited energy absorption and protective properties, the present lightning arrester can not be applicable to alternating-current ultra-high voltage power grids. The invention is characterized in that the lightning arrester is composed of five lightning arrester elements which are connected in series; the top end of the lightning arrester is provided with an equalizing ring; the interior of the lightning arrester adopts a structure of four-column resistor piles which are connected in parallel; the four-column resistor piles in each element are divided into five groups through current-equalizing connecting plates; and the interior of each lightning arrester element is provided with a parallel capacitor bank, wherein the upper section is connected with the four-column capacitor in parallel, the upper two sections are connected with a five-column capacitor in parallel, and the upper three sections are connected with a two-column capacitor in parallel. The invention is applicable to 1000-kilovolt alternating-current ultra-high voltage power transmission engineering.
Owner:FUSHUN ELECTRIC PORCELAIN MFG CO LTD

Tin-based perovskite solar cell and preparation method thereof

The invention belongs to the technical field of novel thin film solar cell preparation, and particularly discloses a tin-based perovskite solar cell and a preparation method thereof. According to the method, phenylethylamine bromide is added into a tin-based perovskite precursor solution, and the tin-based perovskite thin film is prepared by adopting one-step spin coating. The additive is helpful for improving the crystallization quality of the film, improving the morphology, reducing the internal defect mode and reducing non-radiative recombination. In addition, a matching energy band structure formed by the absorption layer prepared by the technology and the charge transport layer enhances the carrier transport capability. The photoelectric conversion efficiency of the corresponding tin-based perovskite solar cell device reaches 14.65%, and the photoelectric conversion efficiency of the tin-based perovskite solar cell device is still kept above 90% of the initial value after the tin-based perovskite solar cell device is placed for 4800 hours. The data show that the addition of the phenethylamine bromide in the precursor solution is a preparation method for effectively improving the photoelectric conversion efficiency and the stability of the tin-based perovskite battery.
Owner:SICHUAN UNIV

A low on-resistance trench mosfet structure and its preparation method

The invention discloses a low-on-resistance groove type MOSFET structure and a preparation method thereof. The invention relates to the semiconductor technology. The low-on-resistance trench type MOSFET structure comprises a semiconductor substrate and also comprises a semiconductor epitaxial layer main body, a diaphragm layer and a metal covering layer are sequentially fixed on the semiconductorsubstrate, grooves which are arranged tightly and are of small channel structures are formed in the semiconductor epitaxial layer main body and located on a lower portion of the diaphragm layer in anarray mode, at least one annular groove is formed in each groove in the length direction of the groove, and the grooves and the annular grooves are filled with polycrystalline silicon. The bottoms ofthe grooves and the outer sides of the annular grooves are respectively provided with first ion distribution regions and second ion distribution regions of which the ion concentration is higher than that of the semiconductor epitaxial layer main body. The invention further provides the preparation method of the low-on-resistance trench MOSFET structure, the distribution of current in the whole epitaxial layer is more uniform, and the divergence angle is larger such that the on-resistance of the device is reduced, and the overall breakdown voltage of the device is improved.
Owner:江苏长晶科技股份有限公司

Plasma processing equipment and its lower electrode mechanism

ActiveCN103866296BSolve the problem of poor groundingImprove flatnessChemical vapor deposition coatingEngineeringRepeatability
The invention discloses a lower electrode mechanism of plasma processing equipment. The lower electrode mechanism comprises a lower electrode base plate, an ground pole supporting member, a ground pole, a support plate supporting member, a support plate, and a heater, and the lower electrode base plate is grounded. The ground pole supporting member is arranged above the lower electrode base plate, and is capable of being vertically lifted up and down. The upper end of the ground pole is connected to the support plate supporting member, and the lower end of the ground pole is connected to the ground pole supporting member. The support plate supporting member is arranged above the ground pole supporting member, is grounded, and is electrically insulated from the ground pole. The support plate is supported by the support plate supporting member, and is directly grounded through the support plate supporting plate. The heater is arranged between the support plate supporting member and the ground pole supporting member. The lower electrode mechanism has the advantages of simple ground current route and high repeatability, and solves the problem of imperfect earth of lower electrode. The invention also discloses plasma processing equipment comprising the lower electrode mechanism.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

Electrode sheet and electrode belt with quasi-periodic concave-convex liquid-holding structure

The electrode sheet and the electrode belt with a quasi-periodic concave-convex liquid-holding structure provided by the invention belong to the technical field of electrical impedance tomography. The electrode sheet includes: an electrode sheet body with a working surface for fitting the human body; Liquid structure, including several liquid-holding grooves opened on the working surface, the liquid-holding grooves are used to fill the matching medium, several liquid-holding grooves are arranged symmetrically on the central axis on the working surface, and the groove depths of several liquid-holding grooves are the same . Due to the quasi-periodic quasi-periodic concave-convex liquid-holding structure on the working surface of the electrode sheet, the potential distribution on the surface of the electrode sheet can be more uniform and the modeling error can be reduced; in addition, the quasi-periodic concave-convex liquid-holding structure can be used for To accommodate the matching medium, when the electrode sheet moves, it can also ensure that there is enough matching medium on the working surface of the electrode sheet, so that the electrode sheet is in good contact with the surface of the human body, thereby improving the application effect of the matching medium.
Owner:BEIJING HUARUI BOSHI MEDICAL IMAGING TECH CO LTD

Terminal of power semiconductor and manufacturing method of terminal

The invention provides a terminal of a power semiconductor and a manufacturing method of the terminal. The power semiconductor comprises a first semiconductor layer of a first conduction type; the first semiconductor layer contains an active region of a well region doped with a second conduction type; the terminal is positioned in the first semiconductor layer, and comprises a junction terminal expansion region adjacent to the active region and doped with a second conduction type; the doping thickness of the junction terminal expansion region increases along with the increase of the distance to the active region; and the doping concentration of the junction terminal expansion region decreases along with the increase of the distance to the active region. In the terminal structure of the invention, the resistivity of the junction terminal expansion increases along with the decrease of the doping concentration; and the cross sectional area within unit length increases along with the increase of the doping thickness, thus relieving the resistance raising caused by the degression of the doping concentration, leading that the potential distribution of the terminal is even, effectively avoiding the premature breakdown from occurring locally, and improving the tolerable voltage of the terminal.
Owner:BYD SEMICON CO LTD
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