Device and method for preventing backwash liquid from polluting substrate
A substrate and liquid technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as process unit corrosion, substrate secondary pollution, and affecting process unit humidity, so as to prevent corrosion, prevent secondary pollution, The effect of simple structure
Pending Publication Date: 2021-03-23
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
The splashed liquid may splash outside the CUP (collection cup), affecting the humidity of the process unit and causing corrosion to the process unit
In the previous devices for dealing with liquid backsplash, the device was installed above the nozzle, but there was no liquid film formed on the inner wall of the device, and the splashed liquid remained on the inner wall of the device, which may cause secondary pollution to the substrate in the subsequent process.
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[0022] The present invention is further detailed below with reference to the accompanying drawings.
[0023] Such as Figure 1 ~ 3 As shown, the apparatus of the present invention includes a motor 1, a carrier 2, a lifting CUP3, a nozzle 4, a swing arm 5, a splash cover 6, an in-liquid pipe 7, and a regulator valve 8, wherein the output terminal of the motor 1 and the carrier 2 Connectively, the drive bearer 2 is rotated, and the carrier 2 is placed with a substrate 12 that is rotated by the carrier 2, and the outer peripheral of the motor 1 is provided with a lifting and lowering CUP3. The nozzle 4 moves between the inside of the lifting CUP3 through the swing arm 5, and the nozzle 4 is connected to the outer liquid line B, and the liquid B10 of the substrate is conveyed to the nozzle 4 to the nozzle 4.
[0024] A splash cover 6 is mounted on the nozzle 4, and the upper end of the splash cover 6 is connected to the nozzle 4, and the lower end is an open structure, and at least one...
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The invention belongs to the field of substrate wet processing in the semiconductor industry, and relates to a device and method for preventing backwash liquid from polluting a substrate. A splash guard is installed on a nozzle; the upper end of the splash guard is connected with the nozzle; the lower end of the splash guard is of an open structure; at least one liquid inflow pipe is arranged on the splash guard and connected with a liquid inflow pipeline A; liquid A is conveyed into the splash guard through the liquid inflow pipeline A, and the liquid A forms a liquid film on the inner surface of the splash guard; and the nozzle sprays liquid B to the surface of the substrate; the backsplashing liquid B is formed on the surface of the substrate, backsplashed to the liquid film, flows to the surface of the substrate along with the liquid film and is separated from the substrate along with the rotation of the substrate. The liquid B sprayed by the nozzle can be prevented from splashingout of a lifting CUP, the humidity of a process unit is prevented from being affected, and the process unit can be prevented from being corroded by the back-splashed liquid; meanwhile, the backsplashed liquid B can be prevented from being left on the inner surface of the nozzle or the inner surface of the splash guard, and secondary pollution to the substrate in the subsequent process is avoided.
Description
Technical field [0001] The present invention belongs to the field of semiconductor industry substrate wet treatment, and is specifically a device and method for preventing a sump liquid contamination substrate. Background technique [0002] At present, the type of nozzle used in the semiconductor substrate wet treatment is diverse, depending on the needs of different processes, it may be a columnar nozzle, a fan nozzle, a needle-shaped nozzle, a dihydrate nozzle or other form of nozzle. The liquid pressure used to treat the substrate can be high, up to 20 MPa. Under the same nozzle size and nozzle height conditions, the higher the pressure, the more severe the sump formed after the liquid reaches the substrate. The molten liquid may splash to the CUP (collecting cup), affect the humidity of the process unit, causing corrosion of the process unit. In the device where the liquid mushroom is devices, the apparatus is disposed above the nozzle, but the inner wall of the device has no...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67023H01L21/67051
Inventor 陈兴隆郑云龙
Owner SHENYANG KINGSEMI CO LTD