TFT cutting and separating device

Abstract

The invention discloses a TFT cutting and separating device which comprises a cooling and quenching device, a heating and radiating device and a cutting and separating quality detection module, a glass substrate at the cutting and scribing position is rapidly heated through the heating and radiating device, and the glass substrate at the cutting and scribing position is rapidly cooled through thecooling and quenching device; the cut glass is subjected to stress change from the scribing part and is broken in the scribing direction, the effect that the cut glass can be broken off along the scribing part is achieved, separation is not conducted in a hard breaking mode, and stress change breaking is started from the interior of the glass body in the separation process; therefore, mechanical broken and cracked glass chippings cannot be generated at the moment of separation, equipment pollution and product pollution are well prevented in a clean environment, and the device can be widely applied to glass cutting and thermal separation after lineation of different thicknesses and lengths. High-precision equipment does not need to align to a scribing part, and scribing position changes ofdifferent similar sizes can be conveniently compatible.

Description

technical field [0001] The invention belongs to the technical field of TFT cutting, and in particular relates to a TFT cutting and separating device. Background technique [0002] In the prior art, the glass after TFT cutting and scribing is mainly separated by breaking. The biggest advantage is that the breaking is reliable, the edge ear material is rarely left, the use is flexible and convenient, and the technology is mature and the application range is large. [0003] The existing technology has the following problems: However, this mechanical breaking method also has major problems. The position accuracy of the first breaking mechanism is very high, and the upper and lower breaking mechanisms need to be strictly aligned with the scribed part after cutting, otherwise it will cause To break the fragments, the breaking mechanism presses the glass surface tightly in the second breaking process, which will cause scratches. In the third breaking process, a large amount of elec...

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Problems solved by technology

[0003] The existing technology has the following problems: However, this mechanical breaking method also has major problems. The position accuracy of the first breaking mechanism is very high, and the upper and lower breaking mechanisms need to be strictly aligned with the scribed part after cutting, otherwise it will cause To break the fragments, the breaking mechanism presses the glass surface tightly in the second breaking process, which will cause scratches. In the third breaking process, a large amount of electrostatically charged glass debris will be generated and adsorbed to the breaking mechanism. During the glass breaking process, these The polluted breaking mechanism will pollute the glass surface again. Fourth, the deviation of product transmission and the deviation of cutting and scribing after changing the process require re-adjustment of the breaking mechanism, which not only causes the quality of breaking to decrease, but also increases the loss , while the adjustment process will greatly affect the high-speed production beat

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