Evaporative heat dissipation device and method for high heat flux density electronic device

Abstract

The invention discloses a micron-scale thin-film cooling device for high-heat-flux electronic devices, which can be used for rapid and efficient heat dissipation of high-heat-flux electronic devices, improves the performance of electronic devices, and prolongs the life of electronic products. Its structure includes: grooved liquid supply substrate, hydrophobic and breathable film and gas-liquid channel cover plate. When the device works normally, it adheres to the upper surface of the high heat flux density electronic chip. The engraved groove liquid supply substrate guides the heat to the upper rib of the substrate and the bottom of the groove. The heat is taken away by the evaporation of the film, and the hot steam is blown out through the ventilation holes to achieve the purpose of heat dissipation. The device avoids complex equipment connections, and only uses simple liquid pumps, fans and simple pipelines to complete the gas-liquid circulation and heat dissipation process. At the same time, the device is small in size, uses the principle of thin film evaporation heat exchange, has high heat exchange efficiency, and has the characteristics of environmental protection and low energy consumption.

Description

technical field [0001] The invention belongs to the technical field of electronic heat dissipation, and in particular relates to an evaporation heat dissipation device and method for high heat flux density electronic devices. Background technique [0002] With the development of microelectronics technology, the number of transistors integrated on a chip per unit area is increasing. While the performance of high-density transistors is improving, the problem of chip heating is becoming more and more serious. At present, the heat flux density of RF power chips in the defense field even exceeds 1kW / cm 2 , the heat flux density of the local hot spot reaches 10kW / cm 2 Above, it is difficult for the chip to work continuously and stably for a long time under the ultra-high heat flux density, and even reduce the power and frequency when the temperature exceeds the allowable temperature, which seriously limits the performance of the device. In order to ensure the safe, stable and ef...

AI Technical Summary

Problems solved by technology

However, the existence of liquid surface tension and viscous force makes it very difficult for the liquid film to fully spread to a micron-scale thickness; at the same time, the thin liquid film will evaporate quickly under high heat flux, how to achieve continuous fluid replenishment to maintain the thin liquid film becomes the second problem

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