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Multi-layer structure adhesive tape for Mini LED mass transfer and preparation method of multi-layer structure adhesive tape

A multi-layer structure and adhesive tape technology, applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problems of high energy consumption, cumbersome manufacturing process, and low efficiency, and achieve high transfer efficiency, improve process efficiency, and prevent breakage Effect

Active Publication Date: 2021-03-30
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing Mini LED mass transfer is completed by SMT process, which has the disadvantages of cumbersome manufacturing process, high energy consumption, and low efficiency.

Method used

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  • Multi-layer structure adhesive tape for Mini LED mass transfer and preparation method of multi-layer structure adhesive tape
  • Multi-layer structure adhesive tape for Mini LED mass transfer and preparation method of multi-layer structure adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1: A multi-layer structural tape for mass transfer of Mini LEDs, including a first adhesive layer 1, a high-transparency substrate 2 and a second adhesive layer 3, the first adhesive layer 1 and the second adhesive layer 3 Attached to both sides of the high-transparency substrate 2, the first adhesive layer 1 and the second adhesive layer 3 are organic silica gel layers, and the first adhesive layer 1 and the second adhesive layer 3 have the same composition, calculated in parts by weight ,include:

[0029] High-viscosity silicone resin (Dow Corning 4600FC) 35 parts, low-viscosity silicone resin (Dow Corning 7645) 65 parts, crosslinking agent (Dow Corning 7028) 0.01 part, platinum catalyst 1.5 parts, anchoring agent (297 of Dow Dow Corning) 1 part, the weight-average molecular weight of the high-viscosity silicone resin is about 500,000, and the weight-average molecular weight of the low-viscosity silicone resin is about 50,000.

[0030] The thickness of the fi...

Embodiment 2

[0036] Example 2: A multi-layer structural adhesive tape for mass transfer of Mini LEDs, including a first adhesive layer 1, a highly transparent substrate 2 and a second adhesive layer 3, the first adhesive layer 1 and the second adhesive layer 3 Attached to both sides of the high-transparency substrate 2, the first adhesive layer 1 and the second adhesive layer 3 are organic silica gel layers, and the first adhesive layer 1 and the second adhesive layer 3 have the same composition, calculated in parts by weight ,include:

[0037] 45 parts of high-viscosity silicone resin (7657 of Dow Dow Corning), 55 parts of low-viscosity silicone resin (7645 of Dow Dow Corning), 0.05 parts of crosslinking agent (7028 of Dow Dow Corning), 0.5 parts of platinum catalyst, anchoring agent (297 of Dow Dow Corning) 0.1 part, the weight-average molecular weight of the high-viscosity silicone resin is about 550,000, and the weight-average molecular weight of the low-viscosity silicone resin is abo...

Embodiment 3

[0044] Example 3: A multi-layer structural tape for mass transfer of Mini LEDs, including a first adhesive layer 1, a high-transparency substrate 2 and a second adhesive layer 3, the first adhesive layer 1 and the second adhesive layer 3 Attached to both sides of the high-transparency substrate 2, the first adhesive layer 1 and the second adhesive layer 3 are organic silica gel layers, and the first adhesive layer 1 and the second adhesive layer 3 have the same composition, calculated in parts by weight ,include:

[0045] 70 parts of high-viscosity silicone resin (7667 of Dow Dow Corning), 60 parts of low-viscosity silicone resin (7646 of Dow Dow Corning), 0.1 part of crosslinking agent (7028 of Dow Dow Corning), 1.8 parts of platinum catalyst, anchoring agent (297 of Dow Dow Corning) 0.6 parts, the weight-average molecular weight of the high-viscosity silicone resin is about 600,000, and the weight-average molecular weight of the low-viscosity silicone resin is about 100,000. ...

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Abstract

The invention discloses a multi-layer structure adhesive tape for Mini LED mass transfer, which comprises a first adhesive layer, a high-transmittance base material and a second adhesive layer, the first adhesive layer and the second adhesive layer are attached to two sides of the high-transmittance base material, and the first adhesive layer and the second adhesive layer are both organic silica gel layers. A preparation method of a multi-layer structure adhesive tape for Mini LED mass transfer comprises the following steps: S1, putting high-viscosity organic silicon resin, low-viscosity organic silicon resin, a cross-linking agent, a catalyst and an anchoring agent into a stirring kettle, and stirring for 1 hour to obtain an organic silicon layer adhesive; S2, coating one side of a high-transmittance base material with the prepared organic silicon layer adhesive, and baking the high-transmittance base material through a baking oven to obtain a first adhesive layer; and S3, coating theother side of the high-transmittance base material in the S2 with the prepared organic silicon layer adhesive, and baking through a baking oven to prepare a second adhesive layer, thereby obtaining afinished product. According to the method, the transfer efficiency is higher after large-scale transfer, the organic silica gel layer cannot be damaged by laser welding, and the adverse phenomena ofadhesive residue, breakage and the like cannot occur in the removal process.

Description

technical field [0001] The invention belongs to the technical field of tapes, and in particular relates to a multi-layer structural tape used for mass transfer of Mini LEDs and a preparation method thereof. Background technique [0002] Mini LED or Micro LED is to make the traditional LED structure thin, miniaturized and matrixed, and then use PCB, flexible PCB and CMOS / TFT integrated circuit technology to make the driving circuit, so as to realize the addressing control and individual Driven display technology. Because the brightness, contrast, response time, viewing angle, resolution and other indicators of Mini LED technology are stronger than LCD, plus the advantages of self-illumination, simple structure, small size and energy saving, it has received extensive attention. [0003] After the Mini LED chip is manufactured, it needs to be transferred to the driver circuit board with double-sided tape to form an LED array, which is called mass transfer. The existing Mini L...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/24C09J7/30C09J183/04
CPCC09J7/255C09J7/243C09J7/25C09J7/24C09J7/30C09J183/04C08L2205/025C08L2201/08C09J2467/006C09J2423/046C09J2469/006C09J2433/006C09J2483/00C08L83/04
Inventor 周玉波邹学良陈艺超陈洪野
Owner CYBRID TECHNOLOGIES INC