Electrostatic chuck and semiconductor processing equipment

A technology of electrostatic chuck and chuck body, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc. It can solve the problems of low heat exchange efficiency, poor chip temperature adjustment effect, and poor thermal conductivity, etc., to improve the process effect, Improve uniform heat effect and improve efficiency
CN112582329BActive Publication Date: 2021-08-13北京中硅泰克精密技术有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
北京中硅泰克精密技术有限公司
Publication Date
2021-08-13

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Abstract

The invention provides an electrostatic chuck and semiconductor processing equipment, which include a chuck body and a base connected to the chuck body, wherein a heat uniform layer and an adhesive are arranged between the surfaces of the chuck body and the base facing each other. The bonding layer, wherein the adhesive layer surrounds the heat even layer to bond the chuck body and the base; the thermal conductivity of the heat even layer is higher than that of the adhesive layer for Heat exchange is performed between the body and the base. The electrostatic chuck and semiconductor processing equipment proposed by the present invention can improve the uniform heat effect between the chuck body and the base, thereby improving the temperature adjustment effect of the electrostatic chuck on the workpiece to be processed.
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Description

technical field

[0001] The invention relates to the field of semiconductor manufacturing, in particular to an electrostatic chuck and semiconductor processing equipment. Background technique

[0002] In the manufacturing process of integrated circuits, electrostatic chucks are usually used to fix the wafer pair and adjust the temperature of the wafer.

[0003] Existing electrostatic chucks usually consist of a chuck body and a temperature-adjusting base. The chuck body regulates the temperature of the wafer by exchanging heat with the wafer adsorbed thereon; the temperature-adjusting base is fixed on the The chuck body on it performs heat exchange, thereby adjusting the temperature of the chuck body, and then indirectly adjusting the temperature of the wafer. However, since the chuck body and the temperature adjustment base are usually bonded by silica gel adhesives, and the thermal conductivity of the silica gel adhesive is poor, the heat exchange efficiency between the te...

Claims

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