Electrostatic chuck and semiconductor processing equipment

A technology of electrostatic chuck and chuck body, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc. It can solve the problems of low heat exchange efficiency, poor chip temperature adjustment effect, and poor thermal conductivity, etc., to improve the process effect, Improve uniform heat effect and improve efficiency

Active Publication Date: 2021-08-13
北京中硅泰克精密技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the chuck body and the temperature adjustment base are usually bonded by silica gel adhesives, and the thermal conductivity of the silica gel adhesive is poor, the heat exchange efficiency between the temperature adjustment base and the chuck body is also relatively low. low, which can cause problems with poor temperature regulation of the die

Method used

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  • Electrostatic chuck and semiconductor processing equipment
  • Electrostatic chuck and semiconductor processing equipment
  • Electrostatic chuck and semiconductor processing equipment

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Embodiment Construction

[0026] The present invention is described in detail below, and examples of embodiments of the present invention are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Furthermore, detailed descriptions of known techniques are omitted if they are not necessary to illustrate the features of the invention. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0027] Those skilled in the art can understand that unless otherwise defined, all terms (including technical terms and scientific terms) used in this embodiment have the same meanings as those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be unders...

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PUM

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Abstract

The invention provides an electrostatic chuck and semiconductor processing equipment, which include a chuck body and a base connected to the chuck body, wherein a heat uniform layer and an adhesive are arranged between the surfaces of the chuck body and the base facing each other. The bonding layer, wherein the adhesive layer surrounds the heat even layer to bond the chuck body and the base; the thermal conductivity of the heat even layer is higher than that of the adhesive layer for Heat exchange is performed between the body and the base. The electrostatic chuck and semiconductor processing equipment proposed by the present invention can improve the uniform heat effect between the chuck body and the base, thereby improving the temperature adjustment effect of the electrostatic chuck on the workpiece to be processed.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an electrostatic chuck and semiconductor processing equipment. Background technique [0002] In the manufacturing process of integrated circuits, electrostatic chucks are usually used to fix the wafer pair and adjust the temperature of the wafer. [0003] Existing electrostatic chucks usually consist of a chuck body and a temperature-adjusting base. The chuck body regulates the temperature of the wafer by exchanging heat with the wafer adsorbed thereon; the temperature-adjusting base is fixed on the The chuck body on it performs heat exchange, thereby adjusting the temperature of the chuck body, and then indirectly adjusting the temperature of the wafer. However, since the chuck body and the temperature adjustment base are usually bonded by silica gel adhesives, and the thermal conductivity of the silica gel adhesive is poor, the heat exchange efficiency between the te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67098H01L21/6831H01L21/6833
Inventor 不公告发明人
Owner 北京中硅泰克精密技术有限公司
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