Preparation method of FOWLP packaging structure with electromagnetic interference protection function

Abstract

The invention discloses a preparation method of an FOWLP packaging structure with an electromagnetic interference protection function, and belongs to the field of integrated circuit packaging. The preparation method comprises the following steps of a) preparing conductive bumps on a chip bonding pad of a chip, and bonding the back surface of the chip with a carrier to prepare a chip packaging unit; b) adhering a metal part to the edge of the obtained chip packaging unit, wherein the metal part and the carrier form a protective base; and c) carrying out plastic packaging in the obtained protection base, grinding the surface after plastic packaging until the conductive bumps are exposed, and carrying out rewiring operation and ball mounting operation on the exposed conductive bumps to obtainthe FOWLP packaging structure with the electromagnetic interference protection function. According to the preparation method provided by the invention, the preparation cost input of the FOWLP packaging structure with the electromagnetic interference protection function can be effectively controlled through a simple and efficient process method and without depending on additional spraying or sputtering devices.

Description

technical field [0001] The invention belongs to the field of integrated circuit packaging and relates to a preparation method of a FOWLP packaging structure with electromagnetic interference protection. Background technique [0002] WLP (Wafer Level Packaging) has the advantage of small size, but as the functional requirements of the chip increase, there will be more pin outputs. FOWLP (Fan Out Wafer Level) can ensure more pin outputs of the chip to a certain extent. In addition, with the development of 5G, the shielding protection requirements for chip packaging electromagnetic interference are getting higher and higher. [0003] At present, the common FOWLP packages are Infineon eWLP package and TSMC FOWLP package structure. Infineon eWLP adopts the Chip Face Down (chip face down) method and attaches it to the carrier through the adhesive film. Then it is plastic sealed. After the plastic sealing is completed, remove the adhesive film and the carrier to leak out the Chip ...

AI Technical Summary

Problems solved by technology

[0004] The implementation method of TSMC FOWLP packaging structure is to obtain bumps on the chip by electroplating, then attach the chip to the carrier with the front side up, and perform plastic packaging. After the plastic packaging is completed, the bumps are leaked by grinding, and the subsequent RDL process is performed to complete the pad layout. And ball planting to get the FOWLP package structure, if you want to achieve the function of electromagnetic interference shielding, you need to use metal sputtering or apply an electromagnetic interference protection layer on the surface of the package, the specific process operation is complicated

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