LED device, manufacturing method of LED device and LED car lamp

Abstract

The present invention discloses an LED device, a manufacturing method of the LED device and an LED car lamp, wherein the LED device comprises a substrate, the substrate is provided with an installation side surface, and at least one chipset is arranged on the installation side surface; a white glue layer is annularly arranged at the periphery of each chipset, a fluorescent layer is arranged at theside, away from the substrate, of each chipset, and each white glue layer is provided with a first side surface away from the substrate. The fluorescent layer is provided with a second side surface away from the chipset, the first side surface is lower than the second side surface, and at least one first groove is concavely formed in the first side surface. The first side surface is arranged to be lower than the second side surface, so that the boundary between the white glue layer and the fluorescent layer is clear, the generation of a light-emitting dark area is avoided, the light-emittingcolor of the LED device is more uniform, the heat radiation path of a chip in the chipset and the external air can be shortened, and the heat dissipation performance of the LED device is improved; byarranging the first groove, the surface area of the first side surface can be increased, so that the surface area of outward heat radiation of the white glue layer is increased, and the heat dissipation performance of the LED device is further improved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an LED device, a manufacturing method of the LED device and an LED vehicle lamp containing the LED device. Background technique [0002] At present, there are two packaging processes for LED devices, one is to fix the chip on the ceramic substrate, stick a fluorescent adhesive film on the chip, and then dot white glue around the chip to complete the package; the other is to fix the chip on the ceramic substrate Finally, dot white glue around the chip first, and then spray fluorescent glue on the chip and white glue to complete the package. In the above two packaging processes, due to the limitation of the process, the boundary between the fluorescent glue and the white glue is not clear, and the boundary between the two will be uneven or the phosphor powder will be scattered, which will affect the spatial distribution uniformity of the light emitting color of the lamp bead, and even...

AI Technical Summary

Problems solved by technology

In the above two packaging processes, due to the limitation of the process, the boundary between the fluorescent glue and the white glue is not clear, and the boundary between the two will be uneven or the phosphor powder will be scattered, which will affect the spatial distribution uniformity of the light emitting color of the lamp bead, and even It will produce obvious light-emitting dark areas and reduce the light quality of LED devices

In addition, some high-power LED devices also have heat dissipation problems. Long-term use of LED devices in high-temperature environments will lead to a decrease in their life, which is not conducive to the use and maintenance of equipment.

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