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High-precision chip photoetching machine and production process

A lithography machine and high-precision technology, which is applied in the field of lithography machines, can solve problems such as increasing process errors, unstable positioning of silicon wafers, and affecting the accuracy of processing, so as to meet processing needs, precise positioning, and precise positioning. The effect of leveling

Inactive Publication Date: 2021-04-06
胡满
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chip processing requires photolithography of silicon wafers, but the uneven placement of silicon wafers or unstable positioning of silicon wafers in existing photolithography will directly affect the accuracy of processing and increase process errors. Therefore, it is now necessary to design a High-precision chip lithography machine and production process

Method used

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  • High-precision chip photoetching machine and production process
  • High-precision chip photoetching machine and production process
  • High-precision chip photoetching machine and production process

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0029] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0030] refer to Figure ...

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Abstract

The invention discloses a high-precision chip photoetching machine and a production process. The high-precision chip photoetching machine comprises a machine table, wherein a vertical frame is arranged on one side of the upper end of the machine table, a vertical electric guide rail is installed on the vertical frame, a transverse frame is fixedly installed at the movable end of the vertical electric guide rail, and a transverse electric guide rail is fixedly installed on the transverse frame; a laser etching machine head is installed at the moving end of the transverse electric guide rail, the interior of the machine table is of a hollow structure, a rotating shaft rotationally connected with the machine table is vertically arranged in the middle of the upper table top of the machine table in a penetrating mode, the upper end of the rotating shaft is connected with a vacuum carrying table, and a driving mechanism used for driving the rotating shaft is arranged at the top in the machine table; four guide grooves are formed in the upper table top of the machine table at equal intervals in the circumferential direction of the machine table, guide rods are fixedly connected into the guide grooves, and the guide rods are sleeved with sliding sleeves in a sliding mode. According to the machine, the silicon wafer to be processed can be accurately leveled, accurately positioned and fixed, high-precision processing of the chip is realized, and the processing requirement of the high-precision chip is met.

Description

technical field [0001] The invention relates to the technical field of lithography machines, in particular to a high-precision chip lithography machine and a production process. Background technique [0002] A chip is an integrated circuit or a microcircuit chip. In electronics, it is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of a semiconductor wafer. [0003] Chip processing requires photolithography of silicon wafers, but the uneven placement of silicon wafers or unstable positioning of silicon wafers in existing photolithography will directly affect the accuracy of processing and increase process errors. Therefore, it is now necessary to design a High-precision chip lithography machine and production process. Contents of the invention [0004] The purpose of the present invention is to solve the shortcomings in the prior art, and propose a high-precision chip photo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H01L21/027H01L21/68H01L21/687
CPCG03F7/70725G03F7/707G03F7/70758G03F7/70775H01L21/0274H01L21/68H01L21/68785
Inventor 胡满
Owner 胡满
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