5results about How to "Achieve high-precision machining" patented technology

This application discloses a machine tool structure with a combined machining head. The application includes: a first base and a second base, the first base having a working area for placing the workpiece to be processed; a column, on which a first X-axis linear module is mounted; a first group of electrical discharge machining (EDM) heads, comprising at least four heads mounted on the first base and respectively connected to the first X-axis linear module, each of the four heads having an independent Y-axis linear module and a Z-axis linear module; and a second group of EDM heads, comprising at least one head mounted on the first base, the second base having a second X-axis linear module, the at least one head connected to the second X-axis linear module, the at least one head having an independent Y-axis linear module and a Z-axis linear module, and all four heads connected to an EDM power supply.

A kind of plate laser cutting equipment and control method, including processing table, portal frame, transverse drive component, longitudinal drive component, image acquisition component and laser cutting component;Portal frame is slidably fitted on processing table, transverse drive component is arranged in the lower end of portal frame, and transverse drive component is used to drive portal frame to slide along the length direction of processing table;Slip seat is slidably fitted on the top of portal frame, longitudinal drive component is arranged in the bottom of slip seat, and longitudinal drive component is used to drive slip seat to slide along the width direction of processing table;Image acquisition component and laser cutting component are oppositely arranged on the two sides of slip seat, so as to realize image acquisition and laser cutting in turn.The overall structure is simple, image acquisition component and laser cutting component are arranged, image acquisition component is set to be able to move along the length and width direction of processing table with drive component, so as to complete overall scanning to entire plate.

The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor chip scribing process, which comprises the following steps of: bonding and curing a silicon wafer and a ceramic wafer, and forming a bonding layer between the silicon wafer and the ceramic wafer; cutting the surface of the silicon wafer by using a scribing knife, and forming a wiring channel and a scribing channel on the surface of the silicon wafer; cutting the two sides of the scribing channel by adopting a scribing knife, and forming a stress release groove penetrating through the silicon wafer and the bonding layer in the thickness direction of the silicon wafer; cutting off the silicon wafer and the bonding layer at the scribing channel by using a first cutting knife; and cutting off the ceramic wafer at the scribing channel by using a second cutting knife to form a plurality of chip units. According to the invention, the interference of the colloid and the deviation caused by the flowing and volume change of the colloid when the distance between the chips is low are avoided, the high-precision processing is realized, and the production benefit is improved.

This invention provides a method, device, and medium for compensating for mold grinding errors based on grinding wheel wear, applicable to the field of machining. The method includes: acquiring a wear image of the grinding wheel to be processed; obtaining the edge contour information of the grinding wheel; determining the vertical wear height H and wear volume V of the grinding wheel; if V > V0, determining the abscissa set U of the mold point cloud; and determining the compensation correction parameter F of the i-th surface point cloud of the optical surface mold to be processed. i According to F i U i The base circle radius R of the optical surface mold to be processed base The compensation correction value Z for the i-th surface point cloud is obtained. i The invention controls a mold correction machine to correct the optical surface mold to be processed. This invention incorporates the wear factor of the grinding wheel into the error compensation process for the optical surface mold, enriching the traditional compensation evaluation indicators for optical surface molds, improving compensation accuracy, and facilitating high-precision machining of optical surface molds.

This utility model discloses a multi-head cutting tool, relating to the field of cutting tool technology. It includes a tool body and multiple cutting heads. The tool body includes a docking portion and a main body portion. The docking portion is used to connect with a processing machine. The orthographic projection area of ​​the docking portion relative to the main body portion is smaller than the orthographic projection area of ​​the main body portion relative to the docking portion, forming a boss portion between the docking portion and the main body portion. The multiple cutting heads are spaced apart along the length of the main body portion, with the same spacing between adjacent cutting heads. By using the multi-head cutting tool disclosed in this application, multiple grooves with the same spacing and internal dimensions (including groove depth and groove width) can be machined from a single raw material, thus solving the problem of low efficiency in the prior art. Furthermore, due to the arrangement of multiple cutting heads, multiple qualified grooves can be machined without adjusting the position of the multi-head cutting tool, achieving high-precision machining.