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Precise grinding processing method of aspheric array structure

A technology of array structure and processing method, which is applied in the field of precision manufacturing, can solve the problems that cannot be used for processing aspheric array structures, etc., and achieve the effect of high-precision processing

Active Publication Date: 2018-11-06
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, none of the above-mentioned methods can be used for processing aspheric array structures, so there is a technical demand for developing a method for processing aspheric array structures in this field,

Method used

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  • Precise grinding processing method of aspheric array structure
  • Precise grinding processing method of aspheric array structure
  • Precise grinding processing method of aspheric array structure

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specific Embodiment approach 1

[0032] This embodiment is directed to a concave aspheric array structure, and is characterized in that the surface shape of the aspheric array sub-unit processed by the present invention is concave. The schematic diagram of the processing device is as figure 1 shown. Realize the present invention needs to adopt as figure 1 The four-axis linkage processing machine shown includes three translational axes, X-axis 7, Y-axis 6, and Z-axis 11, and an angle-controllable workpiece spindle C-axis 5. In addition, the machine tool needs to be equipped with a high-speed tool spindle 1 and a set of in-situ measuring devices 10, which are respectively used to drive the high-speed rotation of the grinding wheel and realize the measurement of the surface profile of the aspheric array subunit.

[0033] The specific steps of processing the concave aspheric array structure include:

[0034] Step 1. Select as image 3 Any one of the grinding wheels 2 in (a), 3(b), and 3(c) is installed on the h...

specific Embodiment approach 2

[0055] This embodiment is directed to a convex aspheric array structure, and is characterized in that the surface shape of the aspheric array sub-unit processed by the present invention is convex. The schematic diagram of the processing device is as figure 2 shown. This embodiment is basically the same as the specific embodiment 1, except for the following two points of difference:

[0056] 1. In step 1, you should select such as image 3 As shown in (d), the V-shaped grinding wheel with a tip arc is installed on the high-speed tool spindle 1, and the axis of the tool spindle must be perpendicular to the axis of the workpiece spindle;

[0057] 2. In step 34, R is the tip arc radius of the V-shaped grinding wheel with tip arc.

Embodiment 1

[0059] In a specific implementation process, a concave aspheric array mold core is ground. The aperture size of the subunits of the lens array is 2mm, arranged in a 2×2 square, and the subunit pitch is 1.25mm. The processing equipment is the five-axis ultra-precision machining machine tool FG650 produced by MooreNanotechnology Company; the mold core material is tungsten carbide; the #325 rounded columnar resin bonded diamond grinding wheel is used for rough grinding, and the #2400 rounded columnar resin bonded diamond grinding wheel is used for rough grinding. For precision and compensation grinding, the fillet radius r of the grinding wheel is 0.15mm, and the diameter D is 2mm; the rotation speed of the grinding wheel is 45000rpm, the rotation speed of the workpiece is 8rpm, and the feed distance is 2μm. The initial processing trajectory of the grinding wheel is obtained by using the process introduced in this method. Figure 5 shown. After the first fine grinding, the in-si...

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Abstract

The invention relates to a precise grinding processing method for an aspheric array structure. A machine tool which is in linkage with an X-axis, a Y-axis, a Z-axis and a C-axis fourth axis are used for processing, the workpiece is installed on a C axis of the machine tool main shaft for controllable rotary motion, simple harmonic motion of phase difference Pi / 2 in X-axis and Y-axis directions along with rotation of C-axis under control of machine tool, meanwhile, an X-direction or a Y-direction superposition motion is superimposed on the X-direction or the Y-direction, and the Z-axis is usedfor carrying out corresponding movement according to the surface shape of the subunit. The processing method breaks through the limitation that an existing array processing method can only process a spherical array on a hard brittle material, and a non-spherical array structure can be precisely machined on the hard brittle material.

Description

technical field [0001] The invention belongs to the technical field of precision manufacturing, and in particular relates to a precision grinding method for an aspherical array structure. Background technique [0002] With the rapid development of modern science and technology, the application of optical components is becoming more and more extensive, and the performance requirements of optical components in the fields of optics and optoelectronics are getting higher and higher. Among them, the lens array is widely used in many new optical systems such as wavefront sensing, three-dimensional imaging, laser shaping, optical storage and optical communication due to its advantages of miniaturization, high integration, light weight and excellent optical performance. Applications. The processing of this array optical structure is one of the main development directions of modern optical device manufacturing, and has broad development prospects. [0003] The processing methods of...

Claims

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Application Information

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IPC IPC(8): B24B1/00
CPCB24B1/00
Inventor 闫广鹏房丰洲
Owner TIANJIN UNIV
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