Wafer edge protection device of monolithic wet etching machine

Abstract

The invention discloses a wafer edge protection device of a monolithic wet etching machine. The wafer edge protection device comprises a clamping device for fixing a wafer; a supply air passage is formed in the clamping device, and a raised ring is formed on the surface of the clamping device; when the wafer is fixed on the clamping device, a surface air passage is formed between the first surface of the wafer and the surface of the clamping device, the raised ring surrounds the peripheral side of the edge of the wafer, and an edge air passage is formed between the raised ring and the edge of the wafer; back gas flows into the surface gas channel through the supply gas channel to form a gas cushion, and flows out of the wafer from the edge gas channel; the second surface of the wafer is a surface needing wet etching, and in the wet etching process, the gas on the back surface of the edge gas channel completely prevents the wet etching liquid flow from flowing to the first surface from the edge of the wafer. According to the method, the wet etching liquid can be completely prevented from flowing to the non-etching surface from the edge of the wafer, so that the non-etching surface of the wafer can be well protected, and the product yield can be improved.

Description

technical field [0001] The invention relates to semiconductor integrated circuit manufacturing equipment, in particular to a wafer edge protection device for a single-chip wet etching machine. Background technique [0002] Wafer cleaning, that is, wet etching, such as wafer backside cleaning, is an important process in the wafer manufacturing process, and is widely used in various product processes such as flash memory (Flash), power (Power) devices, etc. [0003] The wet etching process can be implemented by cleaning multiple wafers in a lot, and can also be implemented by single wafer cleaning. The invention relates to a monolithic wet etching machine. [0004] Such as figure 1 As shown, it is a structural schematic diagram of the clamping device 101 of the existing monolithic wet etching machine; figure 2 It is an enlarged view of the edge of the wafer 103 in FIG. 1; the existing monolithic wet etching machine includes: [0005] A clamping device 101 for fixing a waf...

AI Technical Summary

Problems solved by technology

This makes the edge region of the first surface 103a of the wafer 103 lose the protection of the oxide layer 201, which will adversely affect the front process of the wafer 103.

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